Effects of additives on Cu-MWCNT composite plating films

Journal of the Electrochemical Society

Volumn 157, Issue 3, 2010, Pages

  Arai, Susumu ^a   Saito, Takashi ^a   Endo, Morinobu ^a  

^a SHINSHU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BATH COMPOSITIONS; BIS(3-SULFOPROPYL) DISULFIDE; CHLORIDE IONS; COMPOSITE PLATING; CROSS-SECTIONAL MICROSTRUCTURE; CUPRIC SULFATE; DISPERSING AGENT; ELECTRICAL RESISTIVITY; ELECTRODEPOSITED FILMS; FIELD EMISSION PROPERTY; JANUS GREEN B; PLATING BATH; POLYACRYLIC ACIDS; SMOOTH SURFACE;

CARBON NANOTUBES; CHLORINE COMPOUNDS; COPPER; ELECTRIC CONDUCTIVITY; ELECTROPLATING; ETHYLENE; ETHYLENE GLYCOL; FIELD EMISSION; MORPHOLOGY; MULTIWALLED CARBON NANOTUBES (MWCN); ORGANIC ACIDS; POLYETHYLENE GLYCOLS; POLYETHYLENE OXIDES; SURFACE MORPHOLOGY; ADDITIVES; PLATING; YARN;

COMPOSITE FILMS;

EID: 76349107869     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3274202     Document Type: Article

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