-
1
-
-
33646891147
-
Silicon carbide benefits and advantages for power electronics circuits and systems
-
DOI 10.1109/JPROC.2002.1021562, PII S0018921902055767
-
A. Elasser and T. P. Chow, "Silicon carbide benefits and advantages for power electronics circuits and systems," Proceeding of IEEE, vol. 90, no. 6, pp. 969-986, June 2002. (Pubitemid 43785870)
-
(2002)
Proceedings of the IEEE
, vol.90
, Issue.6
, pp. 969-986
-
-
Elasser, A.1
Chow, T.P.2
-
2
-
-
38449092670
-
SiC-based power converters for high temperature applications
-
L. M. Tolbert, H. Zhang, M. S. Chinthavali, and B. Ozpineci, "SiC-based power converters for high temperature applications," Materials Science Forum, vols. 556-557, 2007, pp. 965-970.
-
(2007)
Materials Science Forum
, vol.556-557
, pp. 965-970
-
-
Tolbert, L.M.1
Zhang, H.2
Chinthavali, M.S.3
Ozpineci, B.4
-
3
-
-
70349329132
-
Efficiency of SiC JFET-based inverters
-
H. Zhang and L. M. Tolbert, "Efficiency of SiC JFET-based inverters," IEEE Conference on Industrial Electronics and Application, Xi'an, China, May 25-27, 2009, pp. 2056-2059.
-
IEEE Conference on Industrial Electronics and Application, Xi'an, China, May 25-27, 2009
, pp. 2056-2059
-
-
Zhang, H.1
Tolbert, L.M.2
-
4
-
-
52349088075
-
Towards an airborne high temperature SiC inverter
-
D. Bergogne, H. Morel, D. Planson, D. Tournier, P. Bevilacqua, B. Allard, R. Meuret, S. Viellard, S. Real, and F. MeibodyTabar, "Towards an airborne high temperature SiC inverter," IEEE Power Electronics Specialists Conference, 2008, pp. 3178-3183.
-
IEEE Power Electronics Specialists Conference, 2008
, pp. 3178-3183
-
-
Bergogne, D.1
Morel, H.2
Planson, D.3
Tournier, D.4
Bevilacqua, P.5
Allard, B.6
Meuret, R.7
Viellard, S.8
Real, S.9
MeibodyTabar, F.10
-
5
-
-
78149424075
-
The vertical silicon carbide JFET - A fast and low loss solid state power switching device
-
P. Friedrichs, H. Mitlehner, R. Schorner, K. O. Dohnke, R. Elpelt, and D. Stephani, "The vertical silicon carbide JFET - a fast and low loss solid state power switching device," European Conference on Power Electronics and Applications, Graz, Austria, 2001.
-
European Conference on Power Electronics and Applications, Graz, Austria, 2001
-
-
Friedrichs, P.1
Mitlehner, H.2
Schorner, R.3
Dohnke, K.O.4
Elpelt, R.5
Stephani, D.6
-
6
-
-
81855202710
-
First inverter using silicon carbide power switches only
-
C. Rebbereh, H. Schierling, and M. Braun, "First inverter using silicon carbide power switches only," European Conference on Power Electronics and Applications, Toulouse, France, 2003.
-
European Conference on Power Electronics and Applications, Toulouse, France, 2003
-
-
Rebbereh, C.1
Schierling, H.2
Braun, M.3
-
7
-
-
33745891203
-
A SiC JFET driver for a 5 kW, 150 kHz three-phase PWM converter
-
S. Round, M. Heldwein, J. Kolar, I. Hofsajer, and P. Friedrichs, "A SiC JFET driver for a 5 kW, 150 kHz three-phase PWM converter,"IEEE Industry Applications Society Annual Meeting, 2005, pp. 410-416.
-
IEEE Industry Applications Society Annual Meeting, 2005
, pp. 410-416
-
-
Round, S.1
Heldwein, M.2
Kolar, J.3
Hofsajer, I.4
Friedrichs, P.5
-
8
-
-
48349141512
-
SiC JFET in contrast to high speed Si IGBT in matrix converter topology
-
D. Domes and W. Hofmann, "SiC JFET in contrast to high speed Si IGBT in matrix converter topology," IEEE Power Electronics Specialists Conference, June, 2007, pp. 54-60.
-
IEEE Power Electronics Specialists Conference, June, 2007
, pp. 54-60
-
-
Domes, D.1
Hofmann, W.2
-
9
-
-
48949100917
-
Comparisons of SiC MOSFET and Si IGBT based motor drive systems
-
T. Zhao, J. Wang, A. Q. Huang, and A. Agarwal, "Comparisons of SiC MOSFET and Si IGBT based motor drive systems," IEEE Industry Applications Society Annual Meeting, September 2007, pp. 331-335.
-
IEEE Industry Applications Society Annual Meeting, September 2007
, pp. 331-335
-
-
Zhao, T.1
Wang, J.2
Huang, A.Q.3
Agarwal, A.4
-
10
-
-
34047129317
-
SiC devices for converter and motor drive applications at extreme temperatures
-
V. Bondarenko, M. S. Mazzola, R. Kelley, C. Wang, Y. Liu, and W. Johnson, "SiC devices for converter and motor drive applications at extreme temperatures," IEEE Aerospace Conference, March 2006, pp. 1-6.
-
IEEE Aerospace Conference, March 2006
, pp. 1-6
-
-
Bondarenko, V.1
Mazzola, M.S.2
Kelley, R.3
Wang, C.4
Liu, Y.5
Johnson, W.6
-
11
-
-
34047098046
-
Ultra-lightweight, high efficiency SiC based power electronics converters for extreme environments
-
S. Mounce, B. McPherson, R. Schupbach, and A. B. Lostetter, "Ultra-lightweight, high efficiency SiC based power electronics converters for extreme environments," IEEE Aerospace Conference, March 2006, pp. 1-19.
-
IEEE Aerospace Conference, March 2006
, pp. 1-19
-
-
Mounce, S.1
McPherson, B.2
Schupbach, R.3
Lostetter, A.B.4
-
12
-
-
46449129361
-
Evaluation of SiC JFETs for a three-phase current-source rectifier with high switching frequency
-
C. J. Cass, Y. Wang, R. Burgos, T. P. Chow, F. Wang, and D. Boroyevich, "Evaluation of SiC JFETs for a three-phase current-source rectifier with high switching frequency," IEEE Applied Power Electronics Conference and Exposition, February 25 - March 1, 2007, Anaheim, CA, pp. 345-351.
-
IEEE Applied Power Electronics Conference and Exposition, February 25 - March 1, 2007, Anaheim, CA
, pp. 345-351
-
-
Cass, C.J.1
Wang, Y.2
Burgos, R.3
Chow, T.P.4
Wang, F.5
Boroyevich, D.6
-
13
-
-
33847728352
-
An integrated silicon carbide (SiC) based single phase rectifier with power factor correction
-
Y. Durrani, E. Aeloiza, L. Palma, and P. Enjeti, "An integrated silicon carbide (SiC) based single phase rectifier with power factor correction," IEEE Power Electronics Specialists Conference, 2005, pp. 2810-2816.
-
IEEE Power Electronics Specialists Conference, 2005
, pp. 2810-2816
-
-
Durrani, Y.1
Aeloiza, E.2
Palma, L.3
Enjeti, P.4
-
14
-
-
0042941400
-
4H-SiC high power SIJFET module
-
Y. Sugawara, D. Takayama, K. Asano, S. Ryu, A. Miyauchi, S. Ogata, and T. Hayashi, "4H-SiC high power SIJFET module," IEEE 15th International Symposium on Power Semiconductor Devices and ICs, April 14-17, 2003, pp. 127-130.
-
IEEE 15th International Symposium on Power Semiconductor Devices and ICs, April 14-17, 2003
, pp. 127-130
-
-
Sugawara, Y.1
Takayama, D.2
Asano, K.3
Ryu, S.4
Miyauchi, A.5
Ogata, S.6
Hayashi, T.7
-
15
-
-
59649122928
-
A 55 kW three-phase inverter with Si IGBTs and SiC Schottky diodes
-
B. Ozpineci, M. Chinthavali, A. Kashyap, L. M. Tolbert, and A. Mantooth, "A 55 kW three-phase inverter with Si IGBTs and SiC Schottky diodes," IEEE Trans. on Industry Applications, vol. 45, no. 1, January/February 2009, pp. 278-285.
-
(2009)
IEEE Trans. on Industry Applications
, vol.45
, Issue.1
, pp. 278-285
-
-
Ozpineci, B.1
Chinthavali, M.2
Kashyap, A.3
Tolbert, L.M.4
Mantooth, A.5
-
16
-
-
77952200634
-
18 kW three phase inverter system using hermetically sealed SiC phase-leg power modules
-
H. Zhang, M. Chinthavali, L. M. Tolbert, J. H. Han, and F. Barlow, "18 kW three phase inverter system using hermetically sealed SiC phase-leg power modules," IEEE Applied Power Electronics Conference, February 21-25, 2010, Palm Spring, CA, pp. 1108-1112.
-
IEEE Applied Power Electronics Conference, February 21-25, 2010, Palm Spring, CA
, pp. 1108-1112
-
-
Zhang, H.1
Chinthavali, M.2
Tolbert, L.M.3
Han, J.H.4
Barlow, F.5
-
17
-
-
79955767125
-
Investigation on the parallel operation of discrete SiC BJTs and JFETs
-
M. Chinthavali, P. Ning, Y. Cui, and L. M. Tolbert, "Investigation on the parallel operation of discrete SiC BJTs and JFETs," IEEE Applied Power Electronics Conference, Fort Worth, TX, March 6-10, 2011, pp. 1076-1083.
-
IEEE Applied Power Electronics Conference, Fort Worth, TX, March 6-10, 2011
, pp. 1076-1083
-
-
Chinthavali, M.1
Ning, P.2
Cui, Y.3
Tolbert, L.M.4
-
18
-
-
80052099773
-
High temperature (250 ° C) silicon carbide power modules with integrated gate drive boards
-
B. Reese, B. McPherson, R. Shaw, J. Hornberger, R. Schupbach, A. Lostetter, B. Rowden, A. Mantooth, S. Ang, J. Balda, K. Okumura, and T. Otsuka, "High temperature (250 ° C) silicon carbide power modules with integrated gate drive boards," IMAPS International Conference & Exhibition in High Temperature Electronics (HITEC), 2010, pp. 297-304.
-
IMAPS International Conference & Exhibition in High Temperature Electronics (HITEC), 2010
, pp. 297-304
-
-
Reese, B.1
McPherson, B.2
Shaw, R.3
Hornberger, J.4
Schupbach, R.5
Lostetter, A.6
Rowden, B.7
Mantooth, A.8
Ang, S.9
Balda, J.10
Okumura, K.11
Otsuka, T.12
-
20
-
-
2342510205
-
Analytical modeling and experimental evaluation of interconnect parasitic inductance on MOSFET switching characteristics
-
Y. Xiao, H. Shah, T. P. Chow, and R. J. Gutmann, "Analytical modeling and experimental evaluation of interconnect parasitic inductance on MOSFET switching characteristics," IEEE Applied Power Electronics Conference, 2004, vol.1, pp. 516-521.
-
IEEE Applied Power Electronics Conference, 2004
, vol.1
, pp. 516-521
-
-
Xiao, Y.1
Shah, H.2
Chow, T.P.3
Gutmann, R.J.4
-
21
-
-
53649091875
-
Parasitic inductance effects on the switching loss measurement of power semiconductor devices
-
Y. Shen, J. Jiang, Y. Xiong, Y. Deng, X. He, and Z. Zeng, "Parasitic inductance effects on the switching loss measurement of power semiconductor devices," IEEE International Symposium on Industrial Electronics, July 9-12, 2006, Montreal, Canada, pp. 847-852.
-
IEEE International Symposium on Industrial Electronics, July 9-12, 2006, Montreal, Canada
, pp. 847-852
-
-
Shen, Y.1
Jiang, J.2
Xiong, Y.3
Deng, Y.4
He, X.5
Zeng, Z.6
-
22
-
-
48349119938
-
Impact of source inductance on synchronous buck regulator FET shoot through performance
-
A. G. Black, "Impact of source inductance on synchronous buck regulator FET shoot through performance," IEEE Power Electronics Specialists Conference, 2007, pp. 981-986.
-
IEEE Power Electronics Specialists Conference, 2007
, pp. 981-986
-
-
Black, A.G.1
-
23
-
-
81855210166
-
-
http://www.siced.com/
-
-
-
-
24
-
-
34948878171
-
Power MOSFETs paralleling operation for high power high density converters
-
H. Wang and F. Wang, "Power MOSFETs paralleling operation for high power high density converters," IEEE Industry Applications Society Annual Meeting, 2006, vol. 5, pp. 2284-2289.
-
IEEE Industry Applications Society Annual Meeting, 2006
, vol.5
, pp. 2284-2289
-
-
Wang, H.1
Wang, F.2
-
25
-
-
33947170483
-
Gate circuit layout optimization of power module regarding transient current imbalance
-
September
-
C. Martin, J. Guichon, J. Schanen, and R. Pasterczyk, "Gate circuit layout optimization of power module regarding transient current imbalance," IEEE Trans. on Power Electronics, vol. 21, no. 5, September 2006, pp. 1176-1184.
-
(2006)
IEEE Trans. on Power Electronics
, vol.21
, Issue.5
, pp. 1176-1184
-
-
Martin, C.1
Guichon, J.2
Schanen, J.3
Pasterczyk, R.4
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