-
2
-
-
1642270553
-
Power electronics as an enabling technology for renewable energy integration
-
Apr.
-
F. Blaabjerg, Z. Chen, "Power electronics as an enabling technology for renewable energy integration," Journal of Power Electronics, vol. 3, no. 2, pp. 81-89, Apr. 2003.
-
(2003)
Journal of Power Electronics
, vol.3
, Issue.2
, pp. 81-89
-
-
Blaabjerg, F.1
Chen, Z.2
-
3
-
-
77952200712
-
Presentation on high-megawatt converter technology workshop
-
D. Mahoney, L. Casey, "Presentation on high-megawatt converter technology workshop," Proceedings of the High Megawatt Converter Workshop, Gaithersburg, MD, January 24, 2007.
-
Proceedings of the High Megawatt Converter Workshop, Gaithersburg, MD, January 24, 2007
-
-
Mahoney, D.1
Casey, L.2
-
5
-
-
1442280115
-
Demonstration of silicon carbide (SiC)-based motor drive
-
H. R. Chang, E. Hanna, A. V. Radun, "Demonstration of silicon carbide (SiC)-based motor drive," Annual Conference of the IEEE Industrial Electronics Society, 2003, pp. 1116-1121.
-
Annual Conference of the IEEE Industrial Electronics Society, 2003
, pp. 1116-1121
-
-
Chang, H.R.1
Hanna, E.2
Radun, A.V.3
-
6
-
-
48349095781
-
A fully integrated 300°C, 4 kW, 3-Phase, SiC motor drive module
-
J. M. Hornberger, E. Cilio, B. McPherson, R. M. Schupbach, A. B. Lostetter, "A fully integrated 300°C, 4 kW, 3-Phase, SiC motor drive module," IEEE Power Electronics Specialists Conference, 2007, pp. 1048-1053.
-
IEEE Power Electronics Specialists Conference, 2007
, pp. 1048-1053
-
-
Hornberger, J.M.1
Cilio, E.2
McPherson, B.3
Schupbach, R.M.4
Lostetter, A.B.5
-
7
-
-
33646891147
-
Silicon carbide benefits and advantages for power electronics circuits and systems
-
June
-
A. Elasser, T.P. Chow, "Silicon carbide benefits and advantages for power electronics circuits and systems," Proceeding of IEEE, vol. 90, no. 6, pp. 969-986, June 2002.
-
(2002)
Proceeding of IEEE
, vol.90
, Issue.6
, pp. 969-986
-
-
Elasser, A.1
Chow, T.P.2
-
8
-
-
0035279619
-
SiC power diodes provide breakthrough performance for a wide range of applications
-
Mar.
-
A. R. Hefner, R. Singh, J. S. Lai, D. W. Berning, S. Bouche, and C. Chapuy, "SiC power diodes provide breakthrough performance for a wide range of applications," IEEE Tranactions on Power Electronics, vol. 16, pp. 273-280, Mar. 2001.
-
(2001)
IEEE Tranactions on Power Electronics
, vol.16
, pp. 273-280
-
-
Hefner, A.R.1
Singh, R.2
Lai, J.S.3
Berning, D.W.4
Bouche, S.5
Chapuy, C.6
-
9
-
-
38449092670
-
SiC-based power converters for high temperature applications
-
L. M. Tolbert, H. Zhang, M. S. Chinthavali, B. Ozpineci, "SiC-based power converters for high temperature applications," Materials Science Forum, vols. 556-557, 2007, pp. 965-970.
-
(2007)
Materials Science Forum
, vol.556-557
, pp. 965-970
-
-
Tolbert, L.M.1
Zhang, H.2
Chinthavali, M.S.3
Ozpineci, B.4
-
10
-
-
70349329132
-
Efficiency of SiC JFET-based inverters
-
H. Zhang, L. M. Tolbert, "Efficiency of SiC JFET-based inverters," IEEE Conference on Industrial Electronics and Applications, Xi'an, China, May 25-27, 2009, pp. 2056-2059.
-
IEEE Conference on Industrial Electronics and Applications, Xi'an, China, May 25-27, 2009
, pp. 2056-2059
-
-
Zhang, H.1
Tolbert, L.M.2
-
11
-
-
52349088075
-
Towards an airborne high temperature SiC inverter
-
D. Bergogne, H. Morel, D. Planson, D. Tournier, P. Bevilacqua, B. Allard, R. Meuret, S. Viellard, S. Rael, F. MeibodyTabar, "Towards an airborne high temperature SiC inverter," IEEE Power Electronics Specialists Conference, 2008, pp. 3178-3183.
-
IEEE Power Electronics Specialists Conference, 2008
, pp. 3178-3183
-
-
Bergogne, D.1
Morel, H.2
Planson, D.3
Tournier, D.4
Bevilacqua, P.5
Allard, B.6
Meuret, R.7
Viellard, S.8
Rael, S.9
MeibodyTabar, F.10
-
12
-
-
77952146326
-
Impact of SiC Devices in Plugin Hybrid Electric Vehicles
-
H. Zhang, L. M. Tolbert, B. Ozpineci, "Impact of SiC Devices in Plugin Hybrid Electric Vehicles," IEEE Industry Applications Society Annual Meeting, Edmonton, Canada, October 5-9, 2008.
-
IEEE Industry Applications Society Annual Meeting, Edmonton, Canada, October 5-9, 2008
-
-
Zhang, H.1
Tolbert, L.M.2
Ozpineci, B.3
-
13
-
-
78049298319
-
State of the art of high temperature power electronics
-
Lodz, Poland
-
C. Buttay, D. Planson, B, Allard, D, Bergogne, " State of the art of high temperature power electronics," Microthrem, Lodz, Poland, 2009.
-
(2009)
Microthrem
-
-
Buttay, C.1
Planson, D.2
Allard, B.3
Bergogne, D.4
-
14
-
-
0038298749
-
A New Substrate for Electronic Packaging: Aluminum Silicon Carbide (AlSiC) Composites
-
M. A. Occhionero, R.W. Adams, and K. P. Fennessy, "A New Substrate for Electronic Packaging: Aluminum Silicon Carbide (AlSiC) Composites," Proceedings of the Forth Annual Portable by Design Conference, Electronics Design, March 24-27, 1997, pp. 398-403.
-
Proceedings of the Forth Annual Portable by Design Conference, Electronics Design, March 24-27, 1997
, pp. 398-403
-
-
Occhionero, M.A.1
Adams, R.W.2
Fennessy, K.P.3
-
15
-
-
0024936503
-
Steady-state thermal conductivity measurements of AlN and SiC substrate materials
-
DOI 10.1109/33.49013
-
E. S. Dettmer, B. M. Romenesko, H. K. Charles, Jr., B. G. Carkhuff, and D. J. Merrill, "Steady-State Thermal Conductivity Measurements of AlN and SiC Substrate Materials," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 12(4), December 1989, pp. 543-547. (Pubitemid 20664739)
-
(1989)
IEEE Transactions on Components, Hybrids, and Manufacturing Technology
, vol.12
, Issue.4
, pp. 543-547
-
-
Dettmer Elizabeth, S.1
Romenesko Bruce, M.2
Charles Harry Jr., K.3
Carkhuff Bliss, G.4
Merrill Douglas, J.5
-
17
-
-
77952201324
-
-
ORNL/TM-2006/515, published by UT-Battelle, LLC, Oak Ridge National Laboratory, Oak Ridge, Tennessee, Nov.
-
F. Barlow and A. Elshabini, "High-Temperature High-Power Packaging Techniques for HEV Traction Applications", ORNL/TM-2006/515, published by UT-Battelle, LLC, Oak Ridge National Laboratory, Oak Ridge, Tennessee, Nov. 2006.
-
(2006)
High-Temperature High-Power Packaging Techniques for HEV Traction Applications
-
-
Barlow, F.1
Elshabini, A.2
-
18
-
-
0003717016
-
-
Second Edition, McGraw-Hill Professional, June 1
-
G. Harman, Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield, Second Edition, McGraw-Hill Professional, June 1, 1997.
-
(1997)
Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield
-
-
Harman, G.1
-
19
-
-
0021649874
-
Effects of Ambient Atmosphere on Aluminum - Copper Wirebond Reliability
-
December
-
D. Olsen, K. James, "Effects of Ambient Atmosphere on Aluminum - Copper Wirebond Reliability," IEEE Transactions on Hybrids and Manufacturing Technology, vol. 7, no. 4, December 1984, pp. 357-362.
-
(1984)
IEEE Transactions on Hybrids and Manufacturing Technology
, vol.7
, Issue.4
, pp. 357-362
-
-
Olsen, D.1
James, K.2
-
20
-
-
0017531969
-
Hybrid Microcircuitry for 300°C Operation
-
September
-
D. Palmer, "Hybrid Microcircuitry for 300°C Operation," IEEE Transactions on Parts, Hybrids, and Packaging, vol. 13, no. 3, September 1977, pp. 252-257.
-
(1977)
IEEE Transactions on Parts, Hybrids, and Packaging
, vol.13
, Issue.3
, pp. 252-257
-
-
Palmer, D.1
-
21
-
-
85010812587
-
Wire Bond Metallurgy for High Temperature Electronics
-
J. T. Benoit, S. Chin, R. R. Grzybowski, L. Shun-Tien, R. Jain, P. McCluskey, T. Bloom, "Wire Bond Metallurgy for High Temperature Electronics," pp. 109-113 in High Temperature Electronics Fourth International Conference, HITEC'98, June 14-18, 1998.
-
High Temperature Electronics Fourth International Conference, HITEC'98, June 14-18, 1998
, pp. 109-113
-
-
Benoit, J.T.1
Chin, S.2
Grzybowski, R.R.3
Shun-Tien, L.4
Jain, R.5
McCluskey, P.6
Bloom, T.7
-
22
-
-
77952117367
-
Evaluation of Aluminum Wire Bonds for High Temperature (2WC) Electronic Packaging
-
J. T. Benoit, R. R. Grzybowski, D. B. Kerwin, "Evaluation of Aluminum Wire Bonds for High Temperature (2WC) Electronic Packaging," Transactions of the Third International High Temperature Electronics Conference, 1996, pp. III-17-23.
-
Transactions of the Third International High Temperature Electronics Conference, 1996
-
-
Benoit, J.T.1
Grzybowski, R.R.2
Kerwin, D.B.3
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