Chip scale thermal management of high brightness LED packages

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5530, Issue , 2004, Pages 214-223

  Arik, Mehmet ^a   Weaver, Stanton ^a  

^a GE GLOBAL RESEARCH   (United States)

Author keywords

Bump defects; Finite element analysis; High brightness LEDs; Infrared imaging; Microscopic IR

Indexed keywords

BUMP DEFECTS; HIGH BRIGHTNESS LED; MICROSCOPIC IR; PARAMETRIC MODELS;

COOLING; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; INFRARED IMAGING; INFRARED RADIATION; INTEGRATED CIRCUITS; LIGHTING; MICROPROCESSOR CHIPS; RELIABILITY; THERMAL EFFECTS; THERMAL GRADIENTS;

LIGHT EMITTING DIODES;

EID: 15744405583     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.566061     Document Type: Conference Paper

References (6)

1. ANSYS8.0, Ansys8.0 Manual, www.ansys.com, 2004
2. Arik, M, Petroski, J. and Weaver, S., "Thermal Challenges in the Future Generation Solid State Lighting Applications: Light Emitting Diodes", ASME/IEEE INTERPACK 2001 Conference, Kauai, Hawaii, July 2001.
3. Arik, M, Weaver, S., Becker, C., Hsing, M. and Srivastava, A., "Effects of Localized Heat Generations Due to The Color Conversion in Phosphor Particles and Layers of High Brightness Light Emitting Diodes", ASME/IEEE International Electronic Packaging Technical Conference and Exhibition - InterPACK'03, July 6-11, 2003, Hawaii, USA.
4. Garg, J., Arik, M., Weaver, and Saddoughi, S., "Micro fluidic Jets for Thermal Management of Electronics", 2004 ASME Heat Transfer/Fluids Engineering Summer Conference, Charlotte, NC, 2004.
5. ITRS Report, "International Technology Roadmap for Semiconductors", http://public.itrs.net, 2003.
6. Lumileds, http://www.lumileds.com/technology, 2004.