Thermal management design from chip to package for high power InGaN/Sapphire LED applications

Electrochemical and Solid-State Letters

Volumn 12, Issue 6, 2009, Pages

  Horng, R H ^a   Chiang, C C ^a   Tsai, Y L ^a   Lin, C P ^a   Kan, K ^b   Lin, H I ^c   Wuu, D S ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

^b KINIK Company   (Taiwan)

^c Liung Feng Industrial Co Ltd   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP TO PACKAGES; COPPER HEAT SPREADERS; DEVICE PERFORMANCE; DIAMOND LIKES; HEAT DISSIPATIONS; HEAT SPREADERS; HIGH-POWER; HIGH-POWER APPLICATIONS; INJECTION CURRENTS; JUNCTION TEMPERATURES; LED CHIPS; LIGHT EMITTING DIODE LEDS; LIGHT EXTRACTIONS; TEMPERATURE REDUCTIONS; THERMAL MANAGEMENTS; THERMAL RESISTANCES;

CHIP SCALE PACKAGES; COPPER; CORUNDUM; DC GENERATORS; DIAMONDS; HEAT RESISTANCE; HEATING EQUIPMENT; SPREADERS; TEMPERATURE CONTROL; THERMAL CONDUCTIVITY;

LIGHT EMITTING DIODES;

EID: 64549163728     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3110040     Document Type: Article

References (12)

1. X. A. Cao and S. D. Arthur, Appl. Phys. Lett., 85, 3971 (2004).
2. O. B. Shchekin, J. E. Epler, T. A. Trottier, T. Margalith, D. A. Steigerwald, M. O. Holcomb, P. S. Martin, and M. R. Krames, Appl. Phys. Lett., 89, 071109 (2006).
3. J. J. Wierer, D. A. Steigerwald, M. R. Krames, J. J. O'Shea, M. J. Ludowise, G. Christenson, Y. C. Shen, C. Lowery, P. S. Martin, S. Subramanya, Appl. Phys. Lett., 78, 3379 (1993).
4. M. Koike, N. Shibata, H. Kato, and Y. Takahashi, IEEE J. Sel. Top. Quantum Electron., 8, 271 (2002).
5. W. S. Wong, T. Sands, and N. W. Cheung, Appl. Phys. Lett., 72, 599 (1998).
6. R. H. Horng, C. E. Lee, S. C. Hsu, S. H. Huang, C. C. Wu, C. Y. Kung, and D. S. Wuu, Phys. Status Solidi C, 201, 2786 (2004).
7. W. S. Wong, T. Sands, N. W. Cheung, M. Keissl, D. P. Bour, P. Mei, L. T. Romano, and N. M. Johnson, Appl. Phys. Lett., 77, 2822 (2000).
8. H. M. Jung, G. Y. Nam, B. K. Choi, T. H. Lee, H. S. Kim, S. K. Jeon, E. H. Park, and C. T. Kim, Appl. Phys. Lett., 91, 111106 (2007).
9. R. H. Horng, C. C. Chiang, H. Y. Hsiao, X. Zheng, D. S. Wuu, and H. I. Lin, Appl. Phys. Lett., 93, 111907 (2008).
10. K. C. Chen, R. W. Chuang, Y. K. Su, C. L. Lin, H. C. Hsu, J. Q. Huang, and K. F. Yang, in Proceedings of The 57th IEEE Electronic Components and Technology Conference, IEEE, p. 734 (2007).
11. C. C. Chiang, D. S. Wuu, and R. H. Horng, Appl. Phys. Lett., 91, 181108 (2007).
12. G. Farkas, S. Haque, F. Wall, P. S. Martin, A. Poppe, Q. V. V. Vader, and G. Bognár, in The 20th IEEE SEMI-THERM Symposium Proceedings, IEEE, p. 168 (2004).