Applications on MEMS packaging and micro-reactors using wafer-level glass cavities by a low-cost glass blowing method

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 1596-1603

  Shang, Jintang ^a   Chen, Boyin ^a   Lin, Wei ^b   Wong, Ching Ping ^b   Zhang, Di ^a   Xu, Chao ^a  

^a Southeast University   (China)

^b Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANODIC BONDING; BLOWING PROCESS; BONDED WAFERS; CYLINDRICAL CHANNEL; FABRICATION PROCESS; GLASS BUBBLES; GLASS CHANNELS; GLASS WAFER; GLASS-BLOWING; HIGH PRESSURE; HIGH QUALITY; INTERNAL SURFACES; MEMS PACKAGING; MICRO REACTOR; MICRO TOTAL ANALYSIS SYSTEMS; MICROELECTROMECHANICAL SYSTEMS PACKAGING; SEALED CAVITIES; SILICON CAVITY; SOFTENING POINTS; SPHERICAL BUBBLES; SPHERICAL GLASS; STRONG ACIDS; WAFER LEVEL;

CHEMICAL STABILITY; COMPOSITE MICROMECHANICS; COST BENEFIT ANALYSIS; ELECTRONICS PACKAGING; GLASS; MEMS; MICROELECTROMECHANICAL DEVICES; ORGANIC SOLVENTS; PACKAGING; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; WAFER BONDING; WET ETCHING;

GLASS BONDING;

EID: 79960394278     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898724     Document Type: Conference Paper

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