Silicon-based, multi-chip LED package

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 722-727

  Jeung, Won Kyu ^a   Shin, Sang Hyun ^a   Hong, Suk Youn ^a   Choi, Seog Moon ^a   Yi, Sung ^a   Yoon, Young Bok ^a   Kim, Hyun Jun ^a   Lee, Sung Jun ^a   Park, Ki Yeol ^a  

^a Samsung Electro Mechanics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; HEAT RESISTANCE; LOGIC DESIGN; MEMS; POWER ELECTRONICS;

MULTI-CHIP LED PACKAGE; OPTICAL EFFICIENCY; REFLECTOR CUPS;

LIGHT EMITTING DIODES;

EID: 35348908271     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373876     Document Type: Conference Paper

References (6)

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