Investigation of thermally conductive ceramic substrates for high-power LED application

IMPACT Conference 2009 International 3D IC Conference - Proceedings

Volumn , Issue , 2009, Pages 589-592

  Lin, S C ^a   Huang, R F ^b   Chiu, C H ^a  

^a NATIONAL FORMOSA UNIVERSITY   (Taiwan)

^b Tenfolds Technology Co Ltd   (Taiwan)

Author keywords

LED ceramic packages; Thermal measurement; Thermal resistance analysis; Thermo fluid coupled field analysis

Indexed keywords

CERAMIC PACKAGE; CONDUCTIVE CERAMICS; CONDUCTIVE SUBSTRATES; COPPER SHEETS; COUPLED FIELD ANALYSIS; COUPLED FIELDS; FINITE ELEMENT; FINITE ELEMENT SIMULATIONS; HIGH POWER LED; HIGH-POWER; LED CHIPS; LED LIGHTING SYSTEM; NUMERICAL SIMULATION; SILICONE RESIN; THERMAL ANALYSIS; THERMAL CHARACTERISTICS; THERMAL MANAGEMENT; THERMAL MEASUREMENTS; THERMAL RESISTANCE; THERMAL VIAS; THERMALLY CONDUCTIVE ADHESIVES;

CHIP SCALE PACKAGES; COUPLED CIRCUITS; ELECTRIC APPLIANCES; FINITE ELEMENT METHOD; HEAT RESISTANCE; LIGHTING; PACKAGING; RESINS; SILICON CARBIDE; SILICONES; SILVER; SILVER ALLOYS; THERMAL VARIABLES MEASUREMENT; THERMOANALYSIS; THREE DIMENSIONAL;

CERAMIC MATERIALS;

EID: 77950826494     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMPACT.2009.5382253     Document Type: Conference Paper

References (6)

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