Silicon-based packaging platform for light-emitting diode

IEEE Transactions on Advanced Packaging

Volumn 29, Issue 3, 2006, Pages 607-614

  Tsou, Chingfu ^a   Huang, Yu Sheng ^a  

^a FENG CHIA UNIVERSITY   (Taiwan)

Author keywords

Bulk micromachining; Light emitting diode (LED) package; Silicon substrate; Thermal stress

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; MICROMACHINING; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; SOLDERING; THERMAL EXPANSION; THERMAL STRESS;

BULK MICROMACHINING; ELECTRODE-GUIDED INTERCONNECTIONS; SOLDER REFLOW;

LIGHT EMITTING DIODES;

EID: 33747625440     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2006.875409     Document Type: Article

References (19)

1. P. Holm, W. Rhyne, B. Gable, S. P. Rogers, K. Jachimowicz, F. Richard, and D. E. Ackley, "Two-dimensional LED arrays for virtual display image sources," IEEE Trans. Electron Devices, vol. 46, no. 5, pp. 897-904, May 1999.
2. S. Muthu, F. J. Schuurmans, and M. D. Pashley, "Red, green, and blue LED-based while light generation: Issues and control," in Proc. 37th IAS Annu. Meeting. Rec. Industry Applications Conf., Pittsburgh, PA, Oct. 2002, pp. 327-333.
3. S. Muthu and J. Gaines, "Red, green and blue LED-based white light source: Implementation challenges and control design," in Proc. 38th IAS Annu. Meeting. Rec. Industry Applications Conf., Salt Lake City, UT, Oct. 2003, pp. 515-522.
4. M. Arik, J. Petroski, and S. Weaver, "Thermal challenges in the future generation solid-state lighting applications: Light-emitting diodes," in Proc. ITHERM, San Diego, CA, May 2002, pp. 113-120.
5. S. Haque, D. Steigerwald, S. Rudaz, B. Steward, J. Bhat, D. Collins, F. Wall, S. Subramanya, C. Elpedes, P. Elizondo, and P. S. Martin, "Packaging challenges of high-power LEDs for solid state lighting," in IMAPS, Boston, MA, Nov. 2003, pp. 100-105.
6. J. Petroski, "Spacing of high-brightness LEDs on metal substrate PCBs for proper thermal performance," Proc. 9th Intersoc. Conf. Thermal Thermomech. Phenomena in Electron. Syst., pp. 507-514, Jun. 2004.
7. K. Hatada, H. Fujimoto, T. Ochi, and Y. Ishida, "LED array modules by new technology microbump bonding method," IEEE Trans. Compon., Hybrids, Manuf. Technol., vol. 13, no. 3, pp. 521-527, Sep. 1990.
8. R. Bonda, F. Treliant, K. Kaskoun, W. H. Lytle, B. Marlin, G. Swan, J. W. Stafford, and G. Tam, "Physical design and assembly process development of a multichip package containing a light emitting diode (LED) array die," IEEE Trans. Compon., Hybrids, Manuf. Technol. B, vol. 20, no. 4, pp. 389-395, Nov. 1997.
9. N. Narendran, Y. Gu, J. P. Freyssinier, H. Yu, and L. Deng, "Solid-state lighting: Failure analysis of white LEDs," J. Crystal Growth, vol. 268, pp. 449-456, 2004.
10. H. J. J. Yeh and J. S. Smith, "Fluidic self-assembly for the integration of GaAs light-emitting diodes on Si substrates," IEEE Photon. Technol. Lett., vol. 6, no. 6, pp. 706-708, Jun. 1994.
11. K. Takahashi, N. Tadokoro, and S. Takeuchi, "High density LED display panel on silicon microreflector and integrated circuit," in Proc. Electron. Manuf. Technol. Symp., Omiya, Japan, Dec. 1995, pp. 272-275.
12. K. Takahashi, S. Nakajima, and S. Takeuchi, "Full-color LED display panel fabricated on a silicon microreflector," Proc. MEMS, pp. 356-359, Jan. 1997.
13. C. F. Edman, R. B. Swint, C. Gurtner, R. E. Formosa, S. D. Roh, K. E. Lee, P. D. Swanson, D. E. Ackley, and J. J. Coleman, "Electric field directed assembly of an InGaAs LED onto silicon circuitry," IEEE Photon. Technol. Lett., vol. 12, no. 9, pp. 1198-1200, Sep. 2000.
14. S. Hirafune, S. Yamamoto, S. Wada, K. Okanishi, M. Tomita, K. Matsumaru, and T. Suemasu, "Packaging technology for imager using through-hole interconnections in Si substrate," in Proc. 6th CMPT Conf. High Density Microsystem Design and Packaging and Component Failure Analysis, Shanghai, China, Jun. 2004, pp. 303-306.
15. S. Yamamoto, K. Ltoi, T. Suemasu, and T. Takizawa, "Si through-hole interconnections filled with Au-Sn solder by molten metal suction method," in MEMS, Kyoto, Japan, Jan. 2003, pp. 642-645.
16. C. J. Lin, M. T. Lin, S. P. Wu, and F. G. Tseng, "High density and through wafer copper interconnections and solder bumps for MEMS wafer-level packaging," Microsyst. Technol., vol. 10, pp. 517-521, 2004.
17. W. Nakayama, "Thermal issues in microsystems packaging," IEEE Trans. Adv. Packag., vol. 23, no. 4, pp. 602-607, Nov. 2000.
18. R. Ramesham and R. Ghaffarian, "Challenges in interconnection and packaging of microelectromechanical systems (MEMS)," in Proc. Electron. Compon. Technol. Conf., Las Vegas, NV, May 2000, pp. 666-675.
19. N. Kumbhat, P. M. Raj, R. V. Pucha, V. Sundaram, R. Doraiswanti, S. Bhattacharya, S. Hayes, S. Atrnur, S. K. Sitaraman, and R. R. Tummala, "Next generation of package/board materials technology for ultra-high density wiring and fine-pitch reliable interconnection assembly," in ECTC, Las Vegas, NV, Jun. 2004, pp. 1843-1850.