Improved heat-dissipating silicone by nano-materials for LED packaging

2008 2nd IEEE International Nanoelectronics Conference, INEC 2008

Volumn , Issue , 2008, Pages 758-760

  Cao, M L ^a   Pang, F Y ^a   Zhang, M C ^a   Cheng, Z J ^a   Gao, Y ^a   He, P G ^a   Pan, L K ^a   Sun, Z ^a  

^a East China Normal University   (China)

Author keywords

LED packaging; Nano diamond; Thermal conductivity

Indexed keywords

CARBON FIBER REINFORCED PLASTICS; DIAMOND FILMS; DIAMONDS; ELECTRONICS ENGINEERING; FILMS; IMAGING TECHNIQUES; NANOELECTRONICS; OPTICAL MICROSCOPY; PACKAGING MATERIALS; SILICONES; THERMOELECTRICITY;

LED PACKAGING; NANO-COMPOSITE FILMS; NANO-DIAMOND; NANO-DIAMOND PARTICLES; NANO-MATERIALS; OPTICAL TRANSMITTANCE; SILICONE MATERIALS; THERMAL CONDUCTIVITY; UV-VISIBLE;

COMPOSITE FILMS;

EID: 52649130368     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/INEC.2008.4585595     Document Type: Conference Paper

References (14)

1. L.Kim, J. H. Choi, S. H. Jang, M .W. Shin, Thermochimica Acta ,455 (2007) 21.
2. S. Nakamura, Appl. Phys. Lett, 64 (1994) 1687.
3. S. Aanegola, J. Petroski, E. Radkov, SPIE 10 (2003) 16.
4. Y. Narukawa, Optics Photonics News, 4 (2004) 25.
5. L.S. Rohwer, A.M. Srivastava, Electrochem. Soc. Interface ,12 (2003) 36.
6. J. Park, M. Shin, C.C. Lee, Opt. Lett, 29 (2004) 2656.
7. B.J. Huang. P.C Hsu, M.S Wu, C.W Tang , Energy ,32 (2007) 2187.
8. K. Banerjee, S.J. Souri, P. Kapur, Proceedings of the IEEE ,89 (2001) 602.
9. N.S. Xu., Jian Chen, S.Z. Deng, Diamond and Related Materials,11 (2002) 249.
10. Y. Yamamoto, T. Imai, K. Tanabe, T. Tsuno, Y. Kumazawa, N. Fujimori, Diamond and Related Materials, 6 (1997) 1057.
11. S.V.Kidalov, F.M.Shakhov, A.Ya.Vul, Diamond and Related Materials,16(2007)2063.
12. J.M. Bonard, Thin Solid Films, 501 (2006) 8.
13. V.Y. Dolmatov, Russian Chemical Reviews ,70 (2001) 607.
14. R. Wang, W.C.Ye, C.L. Ma, C.M .Wang, Materials Characterization , 59(2008)108.