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Applied Physics Letters

Volumn 94, Issue 1, 2009, Pages

Blech effect in Pb-free flip chip solder joint

(4) Lu, Minhua a Shih, Da Yuan a Lauro, Paul a Goldsmith, Charles a,b

a IBM T J WATSON RESEARCH CENTER (United States)

b IBM MICROELECTRONICS (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; COPPER; DEGRADATION; ELECTROMIGRATION; FLIP CHIP DEVICES; LEAD; LEAD ALLOYS; SILVER; SOLDERING ALLOYS; WELDING;

BLECH EFFECTS; DEGRADATION MECHANISMS; FLIP CHIP SOLDER JOINTS; INTERSTITIAL DIFFUSIONS; LIFE-TIMES; RESISTANCE SHIFTS; SN0.7CU SOLDERS; SNAG SOLDERS; SOLDER JOINTS; ZERO RESISTANCES;

TIN;

EID: 58149523079 PISSN: 00036951 EISSN: None Source Type: Journal
DOI: 10.1063/1.3067863 Document Type: Article

Times cited : (24)

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