Surface tension and density of binary lead and lead-free Sn-based solders

Journal of Physics Condensed Matter

Volumn 17, Issue 50, 2005, Pages 7867-7873

  Kaban, I ^a   Mhiaoui, S ^b   Hoyer, W ^a   Gasser, J G ^b  

^a CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

^b UNIVERSITÉ DE LORRAINE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

SOLDERING ALLOYS; SURFACE TENSION; TEMPERATURE DISTRIBUTION; TIN COMPOUNDS;

BINARY LEAD; TEMPERATURE INTERVAL;

LEAD;

EID: 29144497213     PISSN: 09538984     EISSN: 1361648X     Source Type: Journal    
DOI: 10.1088/0953-8984/17/50/007     Document Type: Article

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