Package embedded heat exchanger for stacked multi-chip module

TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers

Volumn 2, Issue , 2003, Pages 1080-1083

  Lee, Haehyung ^a   Jeong, Yongwon ^a   Shin, Joonghan ^a   Kim, Songyi ^a   Kim, Minha ^b   Kang, Moonkoo ^a   Chun, Kukjin ^a  

^a Seoul National University   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

Costs; Electronic packaging thermal management; Heat sinks; Liquid cooling; Polymers; Silicon; Space heating; Space technology; Thermal conductivity; Thermal resistance

Indexed keywords

ACTUATORS; CHIP SCALE PACKAGES; COSTS; ELECTRONIC COOLING; ELECTRONICS PACKAGING; FABRICATION; HEAT EXCHANGERS; HEAT SINKS; MICROPROCESSOR CHIPS; MICROSYSTEMS; POLYMERS; SILICON; SOLID-STATE SENSORS; SPACE HEATING; THERMAL CONDUCTIVITY; TRANSDUCERS;

CONDUCTIVE SUBSTRATES; ELECTRONIC PACKAGING THERMAL MANAGEMENTS; EMBEDDED HEAT EXCHANGERS; LIQUID COOLING; MICRO-HEAT EXCHANGERS; PACKAGING PROBLEMS; PACKAGING TECHNOLOGIES; SPACE TECHNOLOGIES;

HEAT RESISTANCE;

EID: 30844439484     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2003.1216956     Document Type: Conference Paper

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