High-resolution permanent photoresist laminate for microsystem applications

Journal of Micro/Nanolithography, MEMS, and MOEMS

Volumn 7, Issue 3, 2008, Pages

  Stöhr, Uwe ^a   Vulto, Paul ^a   Hoppe, Paul ^a   Urban, Gerald ^a   Reinecke, Holger ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

Author keywords

Buried channels; Dry film resist; Microfluidics; Permanent resist; Wafer bonding

Indexed keywords

ASPECT RATIO; MICROFLUIDICS; MICROSYSTEMS; PHOTORESISTS;

BURIED CHANNELS; BURIED STRUCTURE; DIRECT WAFER BONDING; DRY FILM RESIST; DRY-FILM PHOTORESISTS; HIGH ASPECT RATIO; HIGH ASPECT RATIO STRUCTURES; HIGH RESOLUTION; MICROFLUIDIC CHIP; MICROSYSTEM APPLICATIONS; PERMANENT RESIST; RESIST LAYERS; RESIST THICKNESS;

WAFER BONDING;

EID: 80055044696     PISSN: 19325150     EISSN: 19325134     Source Type: Journal    
DOI: 10.1117/1.2964217     Document Type: Article

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