Full wafer fabrication process for microfluidic glass chips with electroplated electrodes

TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2007, Pages 117-120

  Vulto, P ^a   Igel, G ^a   Urban, G A ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

Author keywords

Bubble free electrode; Dry film resist; Electroplating; Microfluidics; Sacrificial cathode

Indexed keywords

ACTUATORS; BIOCHIPS; CHEMICAL STABILITY; COPPER PLATING; ELECTROCHEMISTRY; ELECTRODES; ELECTROPLATING; GLASS; MICROSYSTEMS; NANOFLUIDICS; OPTICAL DESIGN; ORGANIC POLYMERS; PHOTORESISTS; SENSORS; SILVER; TRANSDUCERS; WAFER BONDING;

BUBBLE-FREE ELECTRODE; CHEMICAL-; DESIGN FLEXIBILITY; DRY FILM RESIST; GLASS SUBSTRATES; INTERNATIONAL CONFERENCES; MICRO FLUIDIC-CHIP; MICRO-FLUIDIC; MICROFLUIDIC GLASS CHIPS; MICROFLUIDICS; SACRIFICIAL CATHODE; SOLID-STATE SENSORS; WAFER FABRICATIONS;

METALLIZING;

EID: 50049108163     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2007.4300085     Document Type: Conference Paper

References (9)

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