Interfacial reactions in the Sn-(Ag)/(Ni, V) couples and phase equilibria of the Sn-Ni-V system at the Sn-rich corner

Journal of Electronic Materials

Volumn 35, Issue 5, 2006, Pages 922-928

  Chen, Chih Chi ^a   Chen, Sinn Wen ^a   Kao, Ching Y A ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Interfacial reactions; Sn Ag Ni V; Sn Ni V; Under bump metallization (UBM)

Indexed keywords

INTERFACIAL REACTIONS; SN-AG-NI-V; SN-NI-V; UNDER-BUMP METALLIZATION (UBM);

ISOTHERMS; MICROELECTRONICS; PHASE EQUILIBRIA; REACTION KINETICS; SOLDERING; VANADIUM;

SEMICONDUCTING TIN COMPOUNDS;

EID: 33745046885     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02692548     Document Type: Conference Paper

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