SCOPUS 정보 검색 플랫폼

Volumn 466, Issue 1-2, 2008, Pages 73-79

Effect of boron content in electroless Ni-B layer on plating layer properties and soldering characteristics with Sn-Ag solder

(9) Yoon, Jeong Won a Koo, Ja Myeong a Kim, Jong Woong a Ha, Sang Su a Noh, Bo In a Lee, Chang Yong a Park, Jong Hyun b Shur, Chang Chae a Jung, Seung Boo a

a Sungkyunkwan University (South Korea)

b SAMSUNG Electronics (South Korea)

Author keywords

Diffusion; Kinetics; Metallography; Solid state reactions; Surfaces and interfaces

Indexed keywords

BORON; BORON COMPOUNDS; BORON DEPOSITS; BRAZING; ELECTRIC PROPERTIES; ELECTRIC RESISTANCE; ELECTROLESS PLATING; ERROR ANALYSIS; NICKEL; NICKEL ALLOYS; NICKEL DEPOSITS; NONMETALS; PLATING; SILVER; SOLDERING; SOLDERING ALLOYS; SURFACE REACTIONS; TIN ALLOYS; WELDING;

BORON CONTENT; CRYSTALLINITY; DIFFUSION; ELECTRICAL PROPERTIES; ELECTRICAL RESISTIVITIES; ELECTROLESS NI; ELECTROLESS NICKEL; INTERFACIAL REACTIONS; KINETICS; METALLOGRAPHY; P H VALUES; PLATING LAYER; REACTION LAYERS; SN-AG SOLDER; SOLDERABILITY; SOLID STATE REACTIONS; SURFACES AND INTERFACES;

TIN;

EID: 50649110979 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2007.11.012 Document Type: Article

Times cited : (23)

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