Interfacial reactions of Sn-3.5% Ag and Sn-3.5% Ag-0.5% Cu solder with electroless Ni/Au metallization during multiple reflow cycles

Journal of Materials Science: Materials in Electronics

Volumn 16, Issue 3, 2005, Pages 153-158

  Sharif, Ahmed ^a   Chan, Y C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION EFFECTS; COPPER PLATING; ELECTROLESS PLATING; INTERFACES (MATERIALS); INTERMETALLICS; METALLIZING; NICKEL PLATING; SILVER ALLOYS; SURFACE REACTIONS; THERMAL EFFECTS; THICKNESS MEASUREMENT; TIN ALLOYS;

BALL GRID ARRAY; ELECTROLESS METALLIZATION; INTERFACIAL REACTIONS; MULTIPLE REFLOW CYCLES;

SOLDERING ALLOYS;

EID: 15344346790     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10854-005-6595-4     Document Type: Article

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