Wetting behaviour of lead free solder on electroplated Ni and Ni-W alloy barrier film

2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Volumn , Issue , 2009, Pages 795-798

  Chew, C S ^a   Haseeb, A S M A ^a   Johan, M R ^a  

^a UNIVERSITY OF MALAYA   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOY SYSTEM; BARRIER FILMS; CITRATE BATHS; COPPER SUBSTRATES; CU SUBSTRATE; ELECTROPLATED NI; INTERMETALLIC COMPOUNDS; LEAD FREE SOLDERS; LEAD-FREE; METALLOGRAPHIC OBSERVATIONS; NI FILMS; NI-W ALLOY; SPREADING RATE; TUNGSTEN CONTENT; WATT'S BATH; WETTING ANGLE; WETTING BEHAVIOUR;

CHIP SCALE PACKAGES; COPPER; COPPER ALLOYS; INTERMETALLICS; LEAD; METALLIC FILMS; PACKAGING; SOLDERING ALLOYS; TUNGSTEN; TUNGSTEN ALLOYS; WETTING;

NICKEL;

EID: 70450002998     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2009.5270639     Document Type: Conference Paper

References (12)

1. Alam, M. O., Chan, Y. C. and Hung, K., " Interfacial reaction of Pb-Sn solder and Sn-Ag solder with electroless Ni deposit during reflow," Journal of Electronic Materials, Vol. 31, No. 10 (2002), pp. 1117-1121.
2. Liang, M. W., Yen, H. T. and Hsieh T. E., "Investigation of electroless cobalt-phosphorous layer and its diffusion barrier properties of Pb-Sn solder," Journal of Electronic Materials, Vol. 35, No. 7 (2006), pp. 1593-1599.
3. Wu, W. C., Hsieh, T. E. and Pan, H. C., "Investigation of electroless Co(W,P) thin film as the diffusion barrier of underbump metallurgy," Journal of Electronic Materials, Vol. 155, No. 5 (2008), pp. D369-D376.
4. Anhock, S. et al, "Reliability of electroless nickel for high temperature application," Proc Advanced Packaging Materials : Processes, Properties and Interfaces, International Conf, Braselton, GA, USA, Mar. 1999, pp. 256-261.
5. Stepanova, L. I., Bodrykh, T. I. and Sviridov, V. V., "Electroless Ni-P and Ni-W-P films as a barrier for thermostimulated diffusion of gold into semiconductor," Proc 3rd High Temperature Electronics European Conf, Berlin, Germany, Apr. 1999, pp. 101-106.
6. Wang, S. J., Kao, H. J. and Liu, C. Y., "Correlation between interfacial reactions and mechanical strengths of Sn(Cu)/Ni(P) solder bumps," Journal of Electronic Materials, Vol. 33, No. 10 (2004), pp. 1130-1136.
7. th Electronics Packaging Technology International Conf, Shanghai, China, Aug. 2006, pp. 1-4.
8. Sharif, A., Chan, Y. C., "Effect of substrate metallization on interfacial reactions and reliability of Sn-Zn-Bi solder joints," Microelectronic Engineering, Vol. 84. No. 2 (2007), pp. 328-335.
9. Amore, S., Ricci, E., Borzone, G. and Novakovic, R., "Wetting behaviour of lead-free Sn-based alloys on Cu and Ni substrates," Materials Science and Engineering, Vol. 495 (2008), pp. 108-112.
10. Lee, N. C., Reflow soldering processes and troubleshooting: SMT, BGA, CSP, and flip chip technologies, Newnes (London United Kingdom, 2002), pp. 21-22.
11. Wang, L. et al, "Effect of sputtered Cu film's diffusion barrier on the growth and field emission properties of carbon nanotubes by chemical vapor deposition," Applied Physics A. Materials Science & Processing, Vol. 90. (2008), pp. 701-704.
12. Haseeb, A.S.M.A. and Bade, K, "LIGA fabrication of nanocrystalline Ni-W alloy micro specimens from ammonia-citrate bath," Microsyst Tecournal, Vol. 14, No. 3 (2008), pp. 379-388.