Mechanical reliability of Sn-Ag BGA solder joints with various electroless Ni-P and Ni-B plating layers

IEEE Transactions on Components and Packaging Technologies

Volumn 33, Issue 1, 2010, Pages 222-228

  Yoon, Jeong Won ^a   Noh, Bo In ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Ball shear test; Electroless nickel boron (EN B); Electroless nickel immersion gold (ENIG); Electroless nickel phosphorus (EN P); Sn 3.5Ag solder

Indexed keywords

BALL-SHEAR TEST; ELECTROLESS NICKEL; ELECTROLESS NICKEL IMMERSION GOLD; ELECTROLESS NICKEL-IMMERSION GOLD (ENIG); SN-3.5AG; SN-3.5AG SOLDER;

BORON; BORON COMPOUNDS; BRITTLE FRACTURE; BRITTLENESS; DUCTILE FRACTURE; FAILURE ANALYSIS; NICKEL; NICKEL ALLOYS; PHOSPHORUS; REACTION RATES; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERED JOINTS; SOLDERING ALLOYS;

TIN;

EID: 77949570778     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2009.2028134     Document Type: Article

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