3D out-of-plane rotational etching with pinned catalysts in metal-assisted chemical etching of silicon

Advanced Functional Materials

Volumn 21, Issue 16, 2011, Pages 3119-3128

  Hildreth, Owen J ^b   Brown, Devin ^c   Wong, Ching P ^a,b  

^a CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

^b Georgia Institute of Technology   (United States)

^c GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

electron beam lithography; metal assisted chemical etching; nanofabrication; silicon

Indexed keywords

IN-PLANE BENDING; METAL-ASSISTED CHEMICAL ETCHING; OUT-OF-PLANE; PINNED STRUCTURE; ROTATION ANGLES; SIMPLE METHOD; THIN METALS;

CATALYSTS; METALS; NANOSTRUCTURES; ROTATION; THREE DIMENSIONAL;

ETCHING;

EID: 80051733389     PISSN: 1616301X     EISSN: 16163028     Source Type: Journal    
DOI: 10.1002/adfm.201100279     Document Type: Article

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