Diffusion parameters and growth mechanism of phases in the Cu-Sn system

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 42, Issue 4, 2011, Pages 952-963

  Paul, A ^a   Ghosh, C ^a   Boettinger, W J ^b  

^a INDIAN INSTITUTE OF SCIENCE   (India)

^b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION COUPLE; DIFFUSION PARAMETERS; GROWTH MECHANISMS; INTERDIFFUSION COEFFICIENTS; INTERMETALLIC COMPOUNDS; KIRKENDALL; SHIFT MEASUREMENT; SIMULTANEOUS GROWTH; TRACER DIFFUSION COEFFICIENTS;

ACTIVATION ENERGY; DIFFUSION; INTERMETALLICS;

TIN;

EID: 79954592627     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-010-0592-9     Document Type: Article

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