Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films

Journal of Materials Engineering and Performance

Volumn 11, Issue 5, 2002, Pages 481-486

  Su, T L ^a   Tsao, L C ^a   Chang, S Y ^a   Chuang, T H ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Ag dissolution; Ag thick film; Ag3Sn intermetallic compound; Sn 3.5Ag Ag; Sn Ag; Soldering reactions

Indexed keywords

ALUMINA; DISSOLUTION; GROWTH KINETICS; INTERFACIAL ENERGY; INTERMETALLICS; MELTING; MORPHOLOGY; SINTERING; SUBSTRATES; THICK FILMS; TIN ALLOYS; VACUUM APPLICATIONS;

ALUMINA SUBSTRATE; LIQUID TIN; SILVER THICK FILM; SOLDERING REACTION; VACUUM MELTING;

SOLDERING ALLOYS;

EID: 0036810736     PISSN: 10599495     EISSN: None     Source Type: Journal    
DOI: 10.1361/105994902770343692     Document Type: Article

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