Vacuum ultraviolet (VUV) surface treatment process for flip chip and 3-D interconnections

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 641-647

  Sakuma, K ^a,b   Nagai, N ^b   Mizuno, J ^b   Shoji, S ^b  

^a IBM RESEARCH TOKYO   (Japan)

^b WASEDA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AMBIENT CONDITIONS; BEFORE AND AFTER; BONDING PADS; CARBON-CARBON BOND; CHARGE ACCUMULATION; CHEMICAL SPECIES; CLEANING PROCESS; ELECTROLESS NI PLATING; ELEMENTAL COMPOSITIONS; FLIP CHIP; INITIAL CONTACT; NOVEL SURFACES; ORGANIC CONTAMINANT; ORGANIC MOLECULES; PHOTOELECTRON SPECTRUM; PLASMA CHARGING; ROOM TEMPERATURE; SURFACE CARBON; SURFACE CONTACT ANGLE; SURFACE DAMAGES; TEMPERATURE INCREASE; TREATMENT PROCESS; VACUUM ULTRAVIOLET LIGHT; VACUUM ULTRAVIOLETS; XPS; XPS ANALYSIS;

AIR CLEANERS; ATOMIC FORCE MICROSCOPY; ATOMIC SPECTROSCOPY; CHEMICAL CLEANING; CONTACT ANGLE; GOLD; ION BOMBARDMENT; PHOTOIONIZATION; PHOTONS; SURFACE TREATMENT; VACUUM; X RAY PHOTOELECTRON SPECTROSCOPY;

SURFACE CLEANING;

EID: 70349678272     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074081     Document Type: Conference Paper

References (12)

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