Fast diffusers in a thermal gradient (solder ball)

Microelectronics Reliability

Volumn 50, Issue 9-11, 2010, Pages 1355-1358

  Lloyd, J R ^a   Connelly, N A ^a   He, Xiaoli ^a   Ryan, K J ^a   Wood, B H ^a  

^a STATE UNIVERSITY OF NEW YORK   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DRIVING FORCES; LEAD FREE SOLDERS; SOLDER BALLS; STEADY STATE CONCENTRATION;

SOLDERING; THERMAL GRADIENTS; TIN;

THERMOANALYSIS;

EID: 79960426419     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2010.07.067     Document Type: Conference Paper

References (3)

1. M.A. Korhonen, P. Børgesen, K.N. Tu, and C.-Y. Li J. Appl. Phys. 73 1993 3790
2. E. Stracke, and Ch. Herzig Phys. Status Solidi 47 1978 513
3. D.C. Yeh, and H.B. Huntington Phys. Rev. Lett. 53 1984 1469