Underfill study for large dice flip chip packages

2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Volumn , Issue , 2009, Pages 40-45

  Lin, Antony ^a   Li, C Y ^a   Shih, Meng Kai ^a   Lai, Yi Shao ^a   Appelt, Bernd ^b   Tseng, Andy ^b  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

^b ASE (US) Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SIZES; DIE CRACKS; DIE SIZE; ELECTRICAL PERFORMANCE; FLIP-CHIP PACKAGES; FLOW CHARACTERISTIC; MASS PRODUCTION; MECHANICAL STRESS; PIN COUNTS; SOLDER BUMP; STRESS MODELING; UNDERFILL MATERIALS; UNDERFILL PROPERTIES; UNDERFILLS; WARPAGES;

CHIP SCALE PACKAGES; CRACKS; DIELECTRIC MATERIALS; DIES; FLIP CHIP DEVICES; STRESS RELIEF; STRESSES;

PACKAGING;

EID: 70449753961     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2009.5270797     Document Type: Conference Paper

References (8)

1. Fine P., Cobb B., Nguyen L., "Flip Chip Underfill Flow Characteristics and Prediction", Proceedings of the 49th Electronic Components and Technology Conference, 1999.
2. N. Iwamoto, M. Nakagawa, G.G.W. Mustoe, "Simulating Underfill Flow for Microelectronics packaging," Proceedings of the 49th Electronic Components and Technology Conference, 1999. pp294-301
3. Qing Tan, Rebecca Cole, Addi Mistry, and Craig Beddingfield, "Failure Mechanisms of Flip Chip DCA Assembly Using Eutectic Solder," Proceedings of the 50th Electronic Components andTechnology Conference, 2000.
4. Pei-Haw Tsao, Chender Huang, Mirng-Ji Lii, Bob Su and Nun-Sian Tsai, "Underfill Characterization for Low-k Dielectric/Cu Interconnect IC Flip-chip Package Reliability," Proceedings of the 53th Electronic Components and Technology Conference, 2004. Pp767-770.
5. Stone, Bill et al., "High Performance Flip Chip PBGA Development," Proc 51th Electronic Components and Technology Conference, May 2001.
6. Ahn, Eun-Chul et al., "Reliability of Flip Chip BGA Package on Organic Substrate," Proc 50th Electronic Components and Technology Conference, May 2000, pp. 1215-1220. [conference]
7. Shim, Jong-Bo et al., "Mechanism of Die and Underfill Cracking in Flip Chip PBGA Package," 2000 International Symposium on Advanced Packaging Materials, pp. 201-205.
8. J-STD-030, "Guideline for Selection and Application of Underfill Material for Flip Chip and other Micropackages", JEDEC, Draft 7, Dec 2000, pp. 9-10.