Reliability evaluation of QFN devices soldered joints with creep model

Chinese Journal of Mechanical Engineering (English Edition)

Volumn 24, Issue 3, 2011, Pages 428-432

  Ji, Feng ^a   Xue, Songbai ^a   Zhang, Liang ^a   Gao, Lili ^a   Sheng, Zhong ^a   Dai, Wei ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Creep strain; Finite element analyses; Lead free solder; Reliability

Indexed keywords

ADDITIVITY; COEFFICIENT OF THERMAL EXPANSION; CREEP MODEL; CREEP STRAIN; FINITE ELEMENT ANALYSES; FINITE ELEMENT ANALYSIS; LEAD COUNTS; LEAD FREE SOLDERS; LEAD-FREE SOLDERED JOINTS; PACKAGE SIZE; QFN PACKAGE; RELIABILITY EVALUATION; SIMULATED RESULTS; SN-3.5AG; SOLDER JOINT RELIABILITY;

FINITE ELEMENT METHOD; MICROPROCESSOR CHIPS; NONLINEAR ANALYSIS; RELIABILITY; SOLDERED JOINTS; SOLDERING ALLOYS; THERMAL EXPANSION;

CREEP;

EID: 79957997788     PISSN: 10009345     EISSN: None     Source Type: Journal    
DOI: 10.3901/CJME.2011.03.428     Document Type: Article

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