Reliability investigations of leadless QFN packages until end-of-life with application-specific board-level stress tests

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 594-600

  Birzer, Christian ^a   Stoeckl, Stephan ^a   Schuetz, Gerhard ^a   Fink, Markus ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; LEAD ALLOYS; PRINTED CIRCUIT BOARDS; SOLDERING ALLOYS; STRESS ANALYSIS;

DROP TESTS; QFN PACKAGES; TEMPERATURE CYCLING TESTS; THERMAL PAD DESIGN;

ELECTRONICS PACKAGING;

EID: 33845581695     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645710     Document Type: Conference Paper

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