The effect of hygro-mechanical and thermo-mechanical stress on delamination of gold bump

Microelectronics Reliability

Volumn 46, Issue 7, 2006, Pages 1087-1094

  Kim, Dae Whan ^a   Kong, Byung Seon ^b  

^a LG Electronics Inc   (South Korea)

^b KCC   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CONCENTRATION (PROCESS); DELAMINATION; FINITE ELEMENT METHOD; GOLD; SHEET MOLDING COMPOUNDS; STRENGTH OF MATERIALS; VAPOR PRESSURE;

EMC (EPOXY MOLDING COMPOUND); FC-CSP (FLIP CHIP-CHIP SCALED PACKAGE); HYGRO-MECHANICAL ANALYSIS; REFLOW TEMPERATURE;

FLIP CHIP DEVICES;

EID: 33646538496     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.07.119     Document Type: Article

References (12)

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