Solder joint formation simulation and reliability study of quad flat no lead package

Science and Technology of Welding and Joining

Volumn 12, Issue 1, 2007, Pages 100-105

  Huang, C Y ^a   Wu, Z H ^a   Zhou, D J ^a  

^a GUILIN UNIVERSITY OF ELECTRONIC TECHNOLOGY   (China)

Author keywords

Fatigue life; Finite element analysis; Process parameters; Quad flat no lead; Solder joint shape

Indexed keywords

EID: 36448964875     PISSN: 13621718     EISSN: 13621718     Source Type: Journal    
DOI: 10.1179/174329306X131857     Document Type: Conference Paper

References (7)

1. C.Y. Huang, Z. H. Wu, H. Y. Huang and D. J. Zhou: Trans. Nonferr. Met. Soc. (China), 2005, 15, (4), 807.
2. B. K. Lim, F. K. S. Poh, D. Y. R. Chong and S. W. Koh: Proc. 6th Conf. on 'Electronics packaging technology', Singapore, December 2004, IEEE, 197.
3. D. J. Zhou: 'Study on SMT solder joint shape theory and CAD technology', PhD thesis, Zhejiang University, Hangzhou, China, 1998.
4. K. A. Brakke: Surface Evolver Manual., Version 2.01, Susquehanna University, Selinsgrove, PA, USA, 1996.
5. B. Z. Hong and L. G. Burrell: IEEE Trans., 1997, 15, (3), 280.
6. V. K. Gupta and D. B. Barker: J. Electron. Packag, 1994, 116, (6), 157.
7. W. Engelmaier: IEEE CHMT, 1983, 6, (3), 232.