Numerical modeling of warpage induced in QFN array molding process

Microelectronics Reliability

Volumn 47, Issue 2-3, 2007, Pages 310-318

  Yang, D G ^a   Jansen, K M B ^a   Ernst, L J ^a   Zhang, G Q ^a,b   van Driel, W D ^b   Bressers, H J L ^b   Janssen, J H J ^b  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAYS; COMPUTER SIMULATION; CURING; DIFFERENTIAL SCANNING CALORIMETRY; DYNAMIC MECHANICAL ANALYSIS; POLYMERS; STRESS RELAXATION; VISCOELASTICITY;

EQUILIBRIUM MODULI; QFN ARRAY MOLDING PROCESS; WARPAGE;

MOLDING;

EID: 33846614192     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.09.036     Document Type: Article

References (8)

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