Thermo mechanical properties and plastic deformation of gold nanolines and gold thin films

Materials Science and Engineering: A

Volumn 528, Issue 19-20, 2011, Pages 6203-6209

  Olliges, Sven ^a   Frank, Stephan ^a   Gruber, Patric A ^b   Auzelyte, Vaida ^c   Solak, Harun ^c   Spolenak, Ralph ^a  

^a ETH ZURICH   (Switzerland)

^b KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

^c PAUL SCHERRER INSTITUTE   (Switzerland)

Author keywords

Diffusion creep; Gold nanolines; Gold thin films; Temperature; Yield strength

Indexed keywords

ACTIVATION ENERGY; GOLD; MEMS; PLASTIC DEFORMATION; POLYIMIDES; TEMPERATURE DISTRIBUTION; TENSILE TESTING; THIN FILMS; YIELD STRESS;

DIFFUSION CREEP; GOLD NANOLINE; GOLD THIN FILMS; KEY ISSUES; MATERIAL BEHAVIOUR; NANOLINES; POLYIMIDE SUBSTRATE; SYSTEM INTEGRATION; TEMPERATURE RANGE; THERMOMECHANICAL PROPERTIES;

DIFFUSION;

EID: 79957945405     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2011.04.041     Document Type: Article

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