A maximum in the strength of nanocrystalline copper

Science

Volumn 301, Issue 5638, 2003, Pages 1357-1359

  Schioøtz, Jakob ^a   Jacobsen, Karsten W ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DEFORMATION; GRAIN SIZE AND SHAPE; MOLECULAR DYNAMICS; NANOSTRUCTURED MATERIALS; PLASTICITY; STRESSES;

COARSE GRAINED MATERIALS;

COPPER;

COPPER; CRYSTALLIN; NANOPARTICLE;

COPPER; NANOTECHNOLOGY;

ABSORPTION; ARTICLE; GRAIN; MOLECULAR DYNAMICS; MOLECULAR MECHANICS; PLASTICITY; PRIORITY JOURNAL; SHEAR STRESS; SIMULATION;

EID: 0043192617     PISSN: 00368075     EISSN: None     Source Type: Journal    
DOI: 10.1126/science.1086636     Document Type: Article

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32. The authors wish to thank T. Vegge and J. P. Sethna for useful discussions and O. H. Nielsen for aid with the computer systems. CAMP is sponsored by the Danish National Research Foundation. The authors gratefully acknowledge financial support from the Materials Research Program of the Danish Research Agency and from the Danish Center for Scientific Computing.