Brittle-to-ductile transition in ultrathin Ta/Cu film systems

Journal of Materials Research

Volumn 24, Issue 6, 2009, Pages 1906-1918

  Gruber, Patric A ^a   Arzt, Eduard ^b   Spolenak, Ralph ^c,d  

^a UNIVERSITY OF STUTTGART   (Germany)

^b INM LEIBNIZ INSTITUTE FOR NEW MATERIALS   (Germany)

^c ETH ZURICH   (Switzerland)

^d UNIVERSITY OF KARLSRUHE   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BRITTLE-TO-DUCTILE TRANSITION; COMPLIANT SUBSTRATES; CRACKING BEHAVIOR; CU FILMS; ENERGY RELEASE; FILMS THINNER; IN-SITU TENSILE TEST; MATERIALS RESEARCH SOCIETIES; METALLIC COMPONENT; SCANNING ELECTRON MICROSCOPE; SEMICONDUCTOR TECHNOLOGY; SYSTEMATIC STUDY; TA FILMS; TOTAL STRAIN; ULTRA-THIN;

BRITTLE FRACTURE; BRITTLENESS; FRACTURE MECHANICS; FRACTURE TOUGHNESS; INTEGRATED CIRCUITS; MAGNETIC FILMS; METALLIC FILMS; MOLECULAR BEAM EPITAXY; POLYIMIDES; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DEVICE MANUFACTURE; STRESS-STRAIN CURVES; TANTALUM; TENSILE TESTING; TESTING;

COPPER;

EID: 68149141424     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2009.0252     Document Type: Article

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