Tensile strength of gold nanointerconnects without the influence of strain gradients

Acta Materialia

Volumn 55, Issue 15, 2007, Pages 5201-5210

  Olliges, Sven ^a   Gruber, Patric A ^b   Auzelyte, Vaida ^c   Ekinci, Yasin ^c   Solak, Harun H ^c   Spolenak, Ralph ^a  

^a ETH ZURICH   (Switzerland)

^b UNIVERSITY OF STUTTGART   (Germany)

^c PAUL SCHERRER INSTITUTE   (Switzerland)

Author keywords

Lithography; Nanocrystalline materials; Plastic deformation; Tension test; X ray diffraction

Indexed keywords

GOLD; LITHOGRAPHY; OPTICAL INTERCONNECTS; PLASTIC DEFORMATION; STRAIN MEASUREMENT; TENSILE TESTING; X RAY DIFFRACTION;

GOLD NANOINTERCONNECTS; LIFT-OFF PROCESS; STRAIN GRADIENTS; SYNCHROTRON-BASED TECHNIQUES;

NANOCRYSTALLINE MATERIALS;

EID: 34547692569     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2007.05.039     Document Type: Article

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