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Volumn , Issue PART B, 2008, Pages 1407-1414

Computational study of grooved microchannel enhancements

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS METHODS; COMPUTATIONAL STUDIES; ELECTRONICS DEVICES; ENHANCED MIXING; ENHANCEMENT TECHNIQUES; INTERNAL FLOWS; MACRO SCALE; NOVEL METHODS; PRESSURE INCREASE; THERMAL DISSIPATION; THERMAL ENHANCEMENT; THERMAL MANAGEMENT; THERMAL PERFORMANCE;

EID: 77952592343     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ICNMM2008-62128     Document Type: Conference Paper
Times cited : (9)

References (14)
  • 1
    • 0000793139 scopus 로고
    • Cramming more components onto integrated circuits
    • April 19
    • Moore, G. E., "Cramming more components onto integrated circuits," Electronics, Vol. 38, No. 8, April 19, 1965.
    • (1965) Electronics , vol.38 , Issue.8
    • Moore, G.E.1
  • 4
    • 84885248952 scopus 로고    scopus 로고
    • New Generation of DBC (Direct Bonded Copper) Substrates for High Efficient Cooling of Power Devices
    • Credle, K. L., Exel, K., Meyer, A., and Schulz-Harder, J., "New Generation of DBC (Direct Bonded Copper) Substrates for High Efficient Cooling of Power Devices," Proceedings of PCIM, 1998.
    • Proceedings of PCIM, 1998
    • Credle, K.L.1    Exel, K.2    Meyer, A.3    Schulz-Harder, J.4
  • 5
    • 13644254606 scopus 로고    scopus 로고
    • Two-phase flow in high-heat-flux micro-channel heat sink for refrigeration cooling applications: Part II - Heat transfer characteristics
    • DOI 10.1016/j.ijheatmasstransfer.2004.09.019, PII S0017931004004211
    • Lee, J. and Mudawar, I., "Two-phase Flow in High-heat-flux Micro-channel Heat Sink for Refrigeration Cooling Applications: Part II - Heat Transfer Characteristics," International Journal of Heat and Mass Transfer, vol. 48, 2005, pp. 941-955. (Pubitemid 40231288)
    • (2005) International Journal of Heat and Mass Transfer , vol.48 , Issue.5 , pp. 941-955
    • Lee, J.1    Mudawar, I.2
  • 7
    • 33750371107 scopus 로고    scopus 로고
    • Electronics packaging cooling: Technologies from gas turbine engine cooling
    • DOI 10.1115/1.2229219
    • Arik. M. and Bunker, R. S., "Electronics Packaging Cooling: Technologies From Gas Turbine Engine Cooling," Journal of Electronic Packaging, Volume 128, Issue 3, September 2006, pp. 215-225. (Pubitemid 44620063)
    • (2006) Journal of Electronic Packaging, Transactions of the ASME , vol.128 , Issue.3 , pp. 215-225
    • Arik, M.1    Bunker, R.S.2
  • 9
    • 0034891760 scopus 로고    scopus 로고
    • Local heat transfer and flow structure on and above a dimpled surface in a channel
    • DOI 10.1115/1.1333694
    • Mahmood, G. I., Hill, M. L., Nelson, D. L., Ligrani, P. M., Moon, H. K., and Glezer, B., "Local Heat Transfer and Flow Structure on and Above a Dimpled Surface in a Channel," Journal of Turbomachinery, Vol. 123, 2001, pp. 115-123. (Pubitemid 32752787)
    • (2001) Journal of Turbomachinery , vol.123 , Issue.1 , pp. 115-123
    • Mahmood, G.I.1    Hill, M.L.2    Nelson, D.L.3    Ligrani, P.M.4    Moon, H.-K.5    Glezer, B.6
  • 11
    • 38749100540 scopus 로고    scopus 로고
    • Numerical simulation of laminar flow and heat transfer inside a microchannel with one dimpled surface
    • DOI 10.1115/1.2429711
    • Wei, X. J., Joshi, Y. K., and Ligrani, P. M., "Numerical Simulation of Laminar Flow and Heat Transfer Inside a Microchannel with One Dimpled Surface," Journal of Electronic Packaging, Vol. 129, March 2007, pp. 63-70. (Pubitemid 351181886)
    • (2007) Journal of Electronic Packaging, Transactions of the ASME , vol.129 , Issue.1 , pp. 63-70
    • Wei, X.J.1    Joshi, Y.K.2    Ligrani, P.M.3
  • 12
    • 38749100968 scopus 로고    scopus 로고
    • Flow Structure and Enhanced Heat Transfer in Channel Flow with Dimpled Surfaces: Applications to Heat Sinks in Microelectronic Cooling
    • June
    • Silva, C., Marotta, E., and Fletcher, L., "Flow Structure and Enhanced Heat Transfer in Channel Flow with Dimpled Surfaces: Applications to Heat Sinks in Microelectronic Cooling," Journal of Electronic Packaging, Vol. 129, June 2007, pp. 157-166.
    • (2007) Journal of Electronic Packaging , vol.129 , pp. 157-166
    • Silva, C.1    Marotta, E.2    Fletcher, L.3
  • 14
    • 0003720363 scopus 로고
    • Third Edition, New York: McGraw-Hill, Inc., 108-158, 244-254, and 311-354
    • Kays, W. M. and Crawford, M. E., Convective Heat and Mass Transfer, Third Edition, New York: McGraw-Hill, Inc., 1993, pp. 75-87, 108-158, 244-254, and 311-354.
    • (1993) Convective Heat and Mass Transfer , pp. 75-87
    • Kays, W.M.1    Crawford, M.E.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.