Computational fluid dynamics simulation for on-chip cooling with carbon nanotube micro-fin architectures

2006 International Conference on Electronic Materials and Packaging, EMAP

Volumn , Issue , 2006, Pages

  Zhong, Xiaolong ^a   Wang, Teng ^b   Liu, Johan ^a,b   Zhang, Yan ^a,b   Cheng, Zhaonian ^b  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON; CHIP SCALE PACKAGES; COMPUTATIONAL FLUID DYNAMICS; COOLING; DATA STRUCTURES; DROPS; DYNAMICS; ELECTRONIC EQUIPMENT MANUFACTURE; FINS (HEAT EXCHANGE); FLUID DYNAMICS; FLUID MECHANICS; NANOCOMPOSITES; NANOPORES; NANOSTRUCTURES; NANOTUBES; PACKAGING MATERIALS; PHOTOLITHOGRAPHY; PRESSURE DROP; QUENCHING; SPEED;

CARBON NANOTUBES;

EID: 51449118614     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2006.4430587     Document Type: Conference Paper

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