Cooling of microelectronic devices packaged in a single chip module using single phase refrigerant R-123

Proceedings of the 7th International Conference on Nanochannels, Microchannels, and Minichannels 2009, ICNMM2009

Volumn , Issue PART A, 2009, Pages 281-285

  Pasupuleti, Tushara ^a   Kandlikar, Satish G ^a  

^a ROCHESTER INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

A-THERMAL; CHIP TEMPERATURE; COOLING DEVICES; ELECTRONIC DEVICE; HIGH POWER DENSITY DEVICES; MICRO-ELECTRONIC DEVICES; MICROCHANNEL COOLING; PRACTICAL ISSUES; SINGLE PHASE; SINGLE-CHIP MODULES; SYSTEM DAMAGE; WATER-COOLED SYSTEM; WORKING CONDITIONS; WORKING FLUID;

CHIP SCALE PACKAGES; COOLING; COOLING SYSTEMS; ELECTRON DEVICES; LEAKAGE (FLUID); MICROCHANNELS; MICROELECTRONICS; REFRIGERANTS; THERMOELECTRIC EQUIPMENT;

FLUIDS;

EID: 77952940965     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ICNMM2009-82262     Document Type: Conference Paper

References (7)

1. Colgan, E.G., Furman, B., Gaynes, M., Graham, W., LaBianca, N., Magerlein, J.H., Polastre, R.J., Rothwell, M.B., Bezama, R.J., Choudhary, R., Marston, K., Toy, H., Wakil, J., Zitz, J., and Schmidt, R., 2007, "Practical Implementation of Silicon Microchannel Coolers for High Power Chips', IEEE Transactions on Components and Packaging Technologies, vol. 30, no. 2, pp. 218-225.
2. Kandlikar, S.G. and Steinke, M. E., 2004, "Single-phase heat transfer enhancement techniques in microchannel and minichannel flows", ASME paper no. ICMM2004-2328, Proceedings of the Second International Conference on Microchannels and Minichannels, Rochester, NY USA.
3. Kishimoto, T. and Sasaki, S., 1987, "Cooling characteristics of diamond-shaped interrupted cooling fins for high power LSI devices," Electron. Lett., vol. 23, no. 9, pp. 456-457. (Pubitemid 17586297)
4. Tuckerman, D.B., Pease, R.F.W., 1981, "High Performance Heat Sinking for VLSI", IEEE Electron Device Lett., vol. EDL-2, no. 5, pp.126-129.
5. Steinke, M.E., Kandlikar, S.G., 2006, ICNMM2006-96227, "Single-phase Heat Transfer in Plain and Enhanced Microchannels," Proceedings of the Fourth International Conference on Nanochannels Microchannels and Minichannels, Limerick, Ireland.
6. Colgan, E.G., Furman, B., Gaynes, M., LaBianca, N., Magerlein, J.H., Polastre, R., Bezama, R., Marston, K., and Schmidt, R., 2007, "High Performance and Sub-Ambient Silicon Microchannel Cooling," Journal of Heat Transfer, Vol. 129, Issue 8, pp. 1046-1051. (Pubitemid 47593231)
7. Kandlikar, S.G., 2005, "High Heat Flux removal with Microchannels- A Roadmap of Challenges and Opportunities", Heat Transfer Engineering, vol. 26, no. 8, pp. 5-14.