The impact of recovery on BTI reliability assessments

IEEE International Integrated Reliability Workshop Final Report

Volumn , Issue , 2010, Pages 12-16

  Reisinger, H ^a   Grasser, T ^a,b   Hofmann, K ^a   Gustin, W ^a   Schlunder C ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b INSTITUTE FOR MICROELECTRONICS   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

AC STRESS; COMBINATIONAL LOGIC; DEGRADATION MECHANISM; DEVICE DEGRADATION; LIFETIME PREDICTION; MEASUREMENT TIME; RELIABILITY ASSESSMENTS;

DEGRADATION;

EID: 79952428166     PISSN: 19308841     EISSN: 23748036     Source Type: Conference Proceeding    
DOI: 10.1109/IIRW.2010.5706474     Document Type: Conference Paper

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