Thermal cycling reliability of Cu/SnAg double-bump flip chip assemblies for 100 μm pitch applications

Journal of Applied Physics

Volumn 105, Issue 1, 2009, Pages

  Son, Ho Young ^a   Kim, Ilho ^a   Lee, Soon Bok ^a   Jung, Gi Jo ^b   Park, Byung Jin ^b   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b NEPES Corporation   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP INTERFACES; CONTACT LOSS; CU/SNAG DOUBLE-BUMPS; EQUIVALENT PLASTIC STRAIN; FAILURE MECHANISM; FATIGUE DEFORMATION; FINE-PITCH FLIP CHIP; FINITE ELEMENT ANALYSIS; FLIP CHIP; FLIP CHIP ASSEMBLIES; INTERFACE SHEAR; LOW TEMPERATURE REGIONS; LOW-CYCLE FATIGUE MODELS; NORMAL STRAIN; PLASTIC STRAIN; SCANNING ACOUSTIC MICROSCOPES; SCANNING ELECTRON MICROSCOPE; SI CHIPS; STRAIN DEFORMATION; THERMAL CYCLE; THERMAL CYCLING RELIABILITY; THERMO-MECHANICAL STRESS;

ACOUSTIC MICROSCOPES; ALUMINUM; CHIP SCALE PACKAGES; ELECTRONIC EQUIPMENT MANUFACTURE; FAILURE ANALYSIS; FLIP CHIP DEVICES; PLASTIC DEFORMATION; PLASTICS; QUALITY ASSURANCE; RELIABILITY ANALYSIS; SCANNING; SCANNING ELECTRON MICROSCOPY; SHEAR STRAIN; SILICON; STRESS CONCENTRATION; THERMAL FATIGUE;

THERMAL CYCLING;

EID: 67649769338     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3042236     Document Type: Article

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