Resistance to electromigration of purely intermetallic micro-bump interconnections for 3D-device stacking

2008 IEEE International Interconnect Technology Conference, IITC

Volumn , Issue , 2008, Pages 19-21

  Labie, Riet ^a   Ruythooren, Wouter ^a   Baert, Kris ^a   Beyne, Eric ^a   Swinnen, Bart ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; COBALT; COBALT COMPOUNDS; COMPUTER NETWORKS; COPPER; DEGRADATION; WELDING;

INTERMETALLIC; INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE; LONG-TERM RELIABILITY;

ELECTROMIGRATION;

EID: 50949114112     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2008.4546913     Document Type: Conference Paper

References (10)

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