Mixed-mode interface toughness of wafer-level Cu-Cu bonds using asymmetric chevron test

Journal of the Mechanics and Physics of Solids

Volumn 56, Issue 3, 2008, Pages 707-718

  Tadepalli, Rajappa ^a   Turner, Kevin T ^b   Thompson, Carl V ^a  

^a Massachusetts Institute of Technology Cambridge   (United States)

^b University of Wisconsin Madison   (United States)

Author keywords

Delamination; Fracture toughness; Layered material; Mechanical testing; Mixed mode toughness

Indexed keywords

DELAMINATION; FRACTURE TOUGHNESS; MECHANICAL TESTING; MICROSYSTEMS; PLASTICITY; SURFACE CHEMISTRY;

INTERFACIAL LOADING; LAYERED MATERIALS; MIXED-MODE TOUGHNESS; THERMOCOMPRESSION BONDS;

BOND STRENGTH (MATERIALS);

EID: 39049084282     PISSN: 00225096     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmps.2007.07.016     Document Type: Article

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