A strain-isolation design for stretchable electronics

Acta Mechanica Sinica/Lixue Xuebao

Volumn 26, Issue 6, 2010, Pages 881-888

  Wu, Jian ^a   Li, Ming ^a,b   Chen, Wei Qiu ^c   Kim, Dae Hyeong ^d   Kim, Yun Soung ^d   Huang, Yong Gang ^a   Hwang, Keh Chih ^e   Kang, Zhan ^b   Rogers, John A ^d,f  

^a NORTHWESTERN UNIVERSITY   (United States)

^b DALIAN UNIVERSITY OF TECHNOLOGY   (China)

^c ZHEJIANG UNIVERSITY   (China)

^d University of Illinois at Urbana Champaign   (United States)

^e TSINGHUA UNIVERSITY   (China)

^f UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

Adhesive; Strain isolation; Stretchable electronics; Substrate; Thin film

Indexed keywords

ACTIVE DEVICES; ADHESIVE LAYERS; ANALYTICAL MODEL; RUBBER BANDS; STRAIN ISOLATION; STRETCHABLE ELECTRONICS;

DEFORMATION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MOTION PICTURES; SEMICONDUCTOR DEVICES; THIN FILMS;

STRAIN;

EID: 79951721393     PISSN: 05677718     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10409-010-0384-x     Document Type: Article

References (78)

1. J.A. Rogers Y. Huang 2009 A curvy, stretchy future for electronics PNAS 106 10875 10876 10.1073/pnas.0905723106
2. J.A. Rogers T. Someya Y. Huang 2010 Materials and mechanics for stretchable electronics Science 327 1603 1607 10.1126/science.1182383
3. J. Viventi D.H. Kim J.D. Moss, et al. 2010 A conformal, bio-interfaced class of silicon electronics for mapping cardiac electrophysiology Sci. Transl. Med. 2 24ra22
4. D.H. Kim J. Viventi J.J. Amsden, et al. 2010 Dissolvable films of silk fibroin for ultrathin, conformal bio-integrated electronics Nat. Mater. 9 511 517 10.1038/nmat2745
5. S. Wagner S.P. Lacour J. Jones, et al. 2005 Electronic skin: architecture and components Physica E 25 326 334 10.1016/j.physe.2004.06.032
6. H.C. Ko M.P. Stoykovich J. Song, et al. 2008 A hemispherical electronic eye camera based on compressible silicon optoelectronics Nature 454 748 753 10.1038/nature07113
7. H.C. Ko G. Shin S. Wang, et al. 2009 Curvilinear electronics formed using silicon membrane circuits and elastomeric transfer elements Small 5 2703 2709 10.1002/smll.200900934
8. G. Shin I. Jung V. Malyarchuk, et al. 2010 Micromechanics and advanced designs for curved photodetector arrays in hemispherical electronic eye cameras Small 6 851 856 10.1002/smll.200901350
9. D.H. Kim J.H Ahn W.M. Choi, et al. 2008 Stretchable and foldable silicon integrated circuits Science 320 507 511 10.1126/science.1154367 (Pubitemid 351590659)
10. D.H. Kim W.M. Choi J.H. Ahn, et al. 2008 Complementary metal oxide silicon integrated circuits incorporating monolithically integrated stretchable wavy interconnects Appl. Phys. Lett. 93 044102 10.1063/1.2963364
11. D.H. Kim J. Song W.M. Choi, et al. 2008 Materials and non-coplanar mesh designs for integrated circuits with linear elastic responses to extreme mechanical deformations PNAS 105 18675 18680 10.1073/pnas.0807476105
12. D.H. Kim Z. Liu Y.S. Kim, et al. 2009 Optimized structural designs for stretchable silicon integrated circuits Small 5 2841 2847 10.1002/smll.200900853
13. J. Yoon A.J. Baca S.I. Park, et al. 2008 Ultrathin silicon solar microcells for semitransparent, mechanically flexible and microconcentrator module designs Nat. Mater. 7 907 915 10.1038/nmat2287
14. A.J. Baca K.J. Yu J. Xiao, et al. 2010 Compact monocrystalline silicon solar modules with high voltage outputs and mechanically flexible designs Energy Environ. Sci. 3 208 211 10.1039/b920862c
15. S.L. Park Y. Xiong R.H. Kim, et al. 2009 Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays Science 325 977 981 10.1126/science.1175690
16. S.I. Park A.P. Le J. Wu, et al. 2010 Light emission characteristics and mechanics of foldable inorganic light-emitting diodes Adv. Mater. 22 3062 3066 10.1002/adma.201000591
17. Y. Huang W. Zhou K.J. Hsia, et al. 2005 Stamp collapse in soft lithography Langmuir 21 8058 8068 10.1021/la0502185 (Pubitemid 44323839)
18. K.J. Hsia Y. Huang E. Menard, et al. 2005 Collapse of stamps for soft lithography due to interfacial adhesion Appl. Phys. Lett. 86 154106 10.1063/1.1900303 (Pubitemid 40861475)
19. W. Zhou Y. Huang E. Menard, et al. 2005 Mechanism for stamp collapse in soft lithography Appl. Phys. Lett. 87 251925 10.1063/1.2149513 (Pubitemid 41816125)
20. M.A. Meitl Z.T. Zhu V. Kumar, et al. 2006 Transfer printing by kinetic control of adhesion to an elastomeric stamp Nat. Mater. 5 33 38 10.1038/nmat1532 (Pubitemid 43049385)
21. M.A. Meitl X. Feng J. Dong, et al. 2007 Stress focusing for controlled fracture in microelectromechanical systems Appl. Phys. Lett. 90 083110 10.1063/1.2679072
22. X. Feng M.A. Meitl A.M. Bowen, et al. 2007 Competing fracture in kinetically controlled transfer printing Langmuir 23 12555 12560 10.1021/la701555n (Pubitemid 350275573)
23. T.H. Kim A. Carlson J.H. Ahn, et al. 2009 Kinetically controlled, adhesiveless transfer printing using microstructured stamps Appl. Phys. Lett. 94 113502 10.1063/1.3099052
24. Kim, S., Wu, J., Carlson, A., et al.: Microstructured elastomeric surfaces with reversible adhesion and examples of their use in deterministic assembly by transfer printing. PNAS. 107, 17095-17100 (2010)
25. D.H. Kim Y.S. Kim J. Wu, et al. 2009 Ultrathin silicon circuits with strain-isolation layers and mesh layouts for high-performance electronics on fabric, vinyl, leather, and paper Adv. Mater. 21 3703 3707 10.1002/adma. 200900405
26. D.Y. Khang H. Jiang Y. Huang, et al. 2006 A stretchable form of single-crystal silicon for high-performance electronics on rubber substrates Science 311 208 212 10.1126/science.1121401 (Pubitemid 43108182)
27. Y. Sun W.M. Choi H. Jiang, et al. 2006 Controlled buckling of semiconductor nanoribbons for stretchable electronics Nat. Nanotechnol. 1 201 207 10.1038/nnano.2006.131
28. H. Jiang Y. Sun J.A. Rogers, et al. 2007 Mechanics of precisely controlled thin film buckling on elastomeric substrate Appl. Phys. Lett. 90 133119 10.1063/1.2719027 (Pubitemid 46516917)
29. W.M. Choi J. Song D.Y. Khang, et al. 2007 Biaxially stretchable "Wavy" silicon nanomembranes Nano Lett. 7 1655 1663 10.1021/nl0706244 (Pubitemid 47140440)
30. J. Song H. Jiang W.M. Choi, et al. 2008 An analytical study of two-dimensional buckling of thin films on compliant substrates J. Appl. Phys. 103 014303 10.1063/1.2828050
31. S.Y. Ryu J. Xiao W. Park, et al. 2009 Lateral buckling mechanics in silicon nanowires on elastomeric substrates Nano Lett. 9 3214 3219 10.1021/nl901450q
32. J. Xiao S.Y. Ryu Y. Huang, et al. 2010 Mechanics of nanowire/nanotube in-surface buckling on elastomeric substrates Nanotechnology 21 085708 10.1088/0957-4484/21/8/085708
33. T. Song J. Xia J.H. Lee, et al. 2010 Arrays of sealed silicon nanotubes as anodes for lithium ion batteries Nano Lett. 10 1710 1716 10.1021/nl100086e
34. D.Y. Khang J. Xiao C. Kocabas, et al. 2008 Molecular scale buckling mechanics on individual aligned single-wall carbon nanotubes on elastomeric substrates Nano Lett. 8 124 130 10.1021/nl072203s (Pubitemid 351177787)
35. J. Xiao H. Jiang D.Y. Khang, et al. 2008 Mechanics of buckled carbon nanotubes on elastomeric substrates J. Appl. Phys. 104 033543 10.1063/1.2968228
36. J. Xiao S. Dunham P. Liu, et al. 2009 Alignment controlled growth of single-walled carbon nanotubes on quartz substrates Nano Lett. 9 4311 4319 10.1021/nl9025488
37. N. Bowden S. Brittain A.G. Evans, et al. 1998 Spontaneous formation of ordered structures in thin films of metals supported on an elastomeric polymer Nature 393 146 149 10.1038/30193 (Pubitemid 28242249)
38. C.T. Koh Z.J. Liu D.Y. Khang, et al. 2007 Edge effects in buckled thin films on elastomeric substrates Appl. Phys. Lett. 91 133113 10.1063/1.2791004 (Pubitemid 47502614)
39. H. Jiang D.Y. Khang H. Fei, et al. 2008 Finite width effect of thin-films buckling on compliant substrate: experimental and theoretical studies J. Mech. Phys. Solids 56 2585 2598 1171.74353 10.1016/j.jmps.2008.03.005 2437519
40. H. Jiang Y. Sun J.A. Rogers, et al. 2008 Post-buckling analysis for the precisely controlled buckling of thin film encapsulated by elastomeric substrates Int. J. Solids Struct. 45 2014 2023 05374678 10.1016/j.ijsolstr.2007. 11.007
41. H. Mei J.Y. Chung H.H. Yu, et al. 2007 Buckling modes of elastic thin films on elastic substrates Appl. Phys. Lett. 90 151902 10.1063/1.2720759 (Pubitemid 46609825)
42. S. Wang J. Song D.H. Kim, et al. 2008 Local versus global buckling of thin films on elastomeric substrates Appl. Phys. Lett. 93 023126 10.1063/1.2956402
43. S.H. Im R. Huang 2008 Wrinkle patterns of anisotropic crystal films on viscoelastic substrates J. Mech. Phys. Solids 56 3315 3330 1171.74352 10.1016/j.jmps.2008.09.011
44. Y. Pang R. Huang 2009 Effect of elastic anisotropy on surface pattern evolution of epitaxial thin films Int. J. Solids Struct. 46 2822 2833 1167.74498 10.1016/j.ijsolstr.2009.03.009
45. J. Song 2010 Herringbone buckling patterns of anisotropic thin films on elastomeric substrates Appl. Phys. Lett. 96 051913 10.1063/1.3309696
46. J. Xiao A. Carlson Z.J. Liu, et al. 2008 Stretchable and compressible thin films of stiff materials on compliant wavy substrates Appl. Phys. Lett. 93 013109 10.1063/1.2955829
47. J. Xiao A. Carlson Z. Liu, et al. 2010 Analytical and experimental studies of the mechanics of deformation in a solid with a wavy surface profile J. Appl. Mech. 77 011003 10.1115/1.3132184
48. X. Chen J.W. Hutchinson 2004 Herringbone buckling patterns of compressed thin films on compliant substrates J. Appl. Mech. 71 597 603 1111.74362 10.1115/1.1756141 (Pubitemid 40122552)
49. Z.Y. Huang W. Hong Z. Suo 2005 Nonlinear analyses of wrinkles in a film bonded to a compliant substrate J. Mech. Phys. Solids 53 2101 2118 1176.74116 10.1016/j.jmps.2005.03.007 2154221 (Pubitemid 40952693)
50. B. Audoly A. Boudaoud 2008 Buckling of a stiff film bound to a compliant substrate-Part I: Formation, linear stability of cylindrical patters, secondary bifurcations J. Mech. Phys. Solids 56 2401 2421 1171.74349 10.1016/j.jmps.2008. 03.003 2419050
51. B. Audoly A. Boudaoud 2008 Buckling of a stiff film bound to a compliant substrate-Part II: A global scenario for the formation of herringbone pattern J. Mech. Phys. Solids 56 2422 2443 1171.74350 10.1016/j.jmps.2008.03.002 2419051
52. B. Audoly A. Boudaoud 2008 Buckling of a stiff film bound to a compliant substrate-Part III: Herringbone solutions at large buckling parameter J. Mech. Phys. Solids 56 2444 2458 1171.74351 10.1016/j.jmps.2008.03.001 2419052
53. H. Jiang D.Y. Khang J. Song, et al. 2007 Finite deformation mechanics in buckled thin films on compliant supports PNAS 104 15607 15612 10.1073/pnas.0702927104 (Pubitemid 350035346)
54. J. Song H. Jiang Z. Liu, et al. 2008 Buckling of a stiff thin film on a compliant substratein large deformation Int. J. Solids Struct. 45 3107 3121 1169.74410 10.1016/j.ijsolstr.2008.01.023
55. R. Huang 2005 Kinetic wrinkling of an elastic film on a viscoelastic substrate J. Mech. Phys. Solids 53 63 89 1134.74387 10.1016/j.jmps.2004.06.007 2106397
56. T. Li Z. Suo 2007 Ductility of thin metal films on polymer substrates modulated by interfacial adhesion Int. J. Solids Struct. 44 1696 1705 1110.74039 10.1016/j.ijsolstr.2006.07.022 (Pubitemid 46161495)
57. A.J. Baca J.H. Ahn Y. Sun, et al. 2008 Semiconductor wires and ribbons for high-performance flexible electronics Angew. Chem. Int. Ed. 47 5524 5542 10.1002/anie.200703238
58. J. Song H. Jiang Y. Huang, et al. 2009 Mechanics of stretchable inorganic electronic materials J. Vac. Sci. Technol. A 27 1107 1125 10.1116/1.3168555
59. Timoshenko S.P., Gere J.M.: Theory of Elastic Stability. McGraw-Hill, New York (1963)
60. J. Song Y. Huang J. Xiao, et al. 2009 Mechanics of non-coplanar mesh design for stretchable electronic circuits J. Appl. Phys. 105 123516 10.1063/1.3148245
61. S. Wang J. Xiao I. Jung, et al. 2009 Mechanics of hemispherical electronics Appl. Phys. Lett. 95 181912 10.1063/1.3256185
62. D.H. Kim J. Xiao J. Song, et al. 2010 Stretchable, curvilinear electronics based on inorganic materials Adv. Mater. 22 2108 2124 10.1002/adma.200902927
63. J.C. Mcdonald G.M. Whitesides 2002 Poly (dimethylsiloxane) as a material for fabricating microfluidic devices Acc. Chem. Res. 35 491 499 10.1021/ar010110q
64. G. Maltezos R. Nortrup S. Jeon, et al. 2003 Tunable organic transistors that use microfluidic source and drain electrodes Appl. Phys. Lett. 83 10 10.1063/1.1609056
65. H.J. Kim Ch. Son B. Ziaie 2008 A multiaxial stretchable interconnect using liquid-alloy-filled elastomeric microchannels Appl. Phys. Lett. 92 011904 10.1063/1.2829595
66. J.H. So J. Thelen A. Qusba, et al. 2009 Reversibly deformable and mechanically tunable fluidic antennas Adv. Funct. Mater. 19 3632 3637 10.1002/adfm.200900604
67. A.C. Siegel S.K.Y. Tang C.A. Nijhuis, et al. 2010 Cofabrication: a strategy for building multicomponent microsystems Acc. Chem. Res. 43 518 528 10.1021/ar900178k
68. J. Jones S.P. Lacour S. Wagner, et al. 2004 Stretchable wavy metal interconnects J. Vac. Sci. Technol. A 22 1723 1725 10.1116/1.1756879
69. T. Li Z. Suo S.P. Lacour, et al. 2005 Compliant thin film patterns of stiff materials as platforms for stretchable electronics J. Mater. Res. 20 3274 3277 10.1557/jmr.2005.0422 (Pubitemid 43072373)
70. D. Brosteaux F. Axisa M. Gonzalez, et al. 2007 Design and fabrication of elastic interconnections for stretchable electronic circuits IEEE Electron Devices Lett. 28 552 554 10.1109/LED.2007.897887 (Pubitemid 47040451)
71. T. Zoumpoulidisa M. Barteka P. de Graafb, et al. 2009 High-aspect-ratio through-wafer parylene beams for stretchable silicon electronics Sens. Actuators A 156 257 264 10.1016/j.sna.2009.03.030
72. Y.Y. Hsu M. Gonzalez I.D. Wolf 2009 In situ observations on deformation behavior and stretchinginduced failure of fine pitch stretchable interconnect J. Mater. Res. 24 3573 3582 10.1557/jmr.2009.0447
73. H.J. Kim T. Maleki P. Wei, et al. 2009 A biaxial stretchable interconnect with liquid-alloy-covered joints on elastomeric substrate J. Microelectromech. Syst. 18 138 146 10.1109/JMEMS.2008.2011118
74. K.L. Lin K. Jain 2009 Design and fabrication of stretchable multilayer self-aligned interconnects for flexible electronics and large-area sensor arrays using excimer laser photoablation IEEE Electron Devices Lett. 30 14 17 10.1109/LED.2008.2008665
75. J.H. Ahn Z. Zhu S.I. Park, et al. 2008 Defect tolerance and nanomechanics in transistors that use semiconductor nanomaterials and ultrathin dielectrics Adv. Funct. Mater. 18 2535 2540 10.1002/adfm.200800176
76. S.I. Park J.H. Ahn X. Feng, et al. 2008 Theoretical and experimental studies of bending of inorganic electronic materials on plastic substrates Adv. Funct. Mater. 18 2673 2684 10.1002/adfm.200800306
77. Z. Jiang Y. Huang A. Chandra 1997 Thermal stresses in layered electronic assemblies J. Electron. Packag. 119 127 132 10.1115/1.2792218 (Pubitemid 127447142)
78. K.P. Wang Y.Y. Huang A. Chandra, et al. 2000 Interfacial shear stress, peeling stress, and die cracking stress in trilayer electronic assemblies IEEE TCPT 23 309 316