Collapse of stamps for soft lithography due to interfacial adhesion

Applied Physics Letters

Volumn 86, Issue 15, 2005, Pages 1-3

  Hsia, K J ^a   Huang, Y ^a   Menard, E ^a,c   Park, J U ^a,c   Zhou, W ^a   Rogers, J ^a,c   Fulton, J M ^b  

^a United States of America   (United States)

^b UNIVERSITY OF WISCONSIN MADISON   (United States)

^c UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERFACIAL ADHESION ENERGY; MECHANICAL COLLAPSE; SOFT LITHOGRAPHY; STAMPS;

ADHESION; ELASTOMERS; FRACTURE MECHANICS; GLASS; INTERFACES (MATERIALS); OPTICAL MICROSCOPY; SURFACE TREATMENT;

LITHOGRAPHY;

EID: 20844437052     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1900303     Document Type: Article

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