High strain rate compression behavior for Sn-37Pb eutectic alloy, lead-free Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu alloys

Microelectronics Reliability

Volumn 49, Issue 3, 2009, Pages 310-317

  Jenq, S T ^a   Chang, Hsuan Hu ^a   Lai, Yi Shao ^b   Tsai, Tsung Yueh ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYS; BRAZING; CERIUM ALLOYS; COPPER ALLOYS; EUTECTICS; LEAD; LEAD ALLOYS; MECHANICAL TESTING; METALLIC GLASS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; STRESS-STRAIN CURVES; TIN; TIN ALLOYS; WELDING;

CU ALLOYS; DYNAMIC STRESS; ELASTO-PLASTIC DEFORMATIONS; EUTECTIC ALLOYS; EUTECTIC SOLDERS; HIGH RATES; HIGH STRAIN RATES; IMPACT TESTS; LEAD-FREE; LEAD-FREE SOLDERS; MECHANICAL RESPONSE; POWER-LAW CREEPS; SATURATION STRESS; SN-37PB; SOLDER MATERIALS; SPLIT HOPKINSON PRESSURE BARS; STRAIN RATE SENSITIVITY PARAMETERS; STRAIN VALUES; STRAIN-RATE HARDENINGS;

STRAIN RATE;

EID: 61349136210     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2009.01.002     Document Type: Article

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