Comparative study of interfacial reactions of high-Sn lead-free solders on single crystal Cu and on polycrystalline Cu

2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Volumn , Issue , 2009, Pages 593-596

  Cui, Yipeng ^a   Huang, Mingliang ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COMPARATIVE STUDIES; CROSS-SECTION MORPHOLOGY; DISSOLUTION RATES; IMC LAYER; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; LEAD FREE SOLDERS; POLYCRYSTALLINE; PURE SN; REACTION TEMPERATURE; REACTION TIME;

CRYSTAL STRUCTURE; DISSOLUTION; ELECTRONICS PACKAGING; LEAD; METAL RECOVERY; MORPHOLOGY; PACKAGING; SEMICONDUCTING INTERMETALLICS; SINGLE CRYSTALS; SOLDERING ALLOYS;

TIN;

EID: 70449879593     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2009.5270679     Document Type: Conference Paper

References (10)

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