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Journal of the Electrochemical Society

Volumn 156, Issue 10, 2009, Pages

Electrodeposition and characterization of eutectic Sn-Ag alloy as solder bumps for flip-chip interconnection

(3) Qin, Yi a Wilcox, G D a Liu, Changqing a

a LOUGHBOROUGH UNIVERSITY (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

AG-ALLOY; BIPHASIC STRUCTURE; DEPOSITED FILMS; ELECTRODEPOSITED FILMS; ELECTRODEPOSITION PROCESS; FINE PITCH; FLIP-CHIP INTERCONNECTION; HOMOGENEOUS COMPOSITION; LEAD FREE SOLDERS; NEAR-EUTECTIC COMPOSITION; SEM; SMOOTH SURFACE; SN-AG ALLOYS; SN-AG SOLDER BUMP; SOLDER BUMP; TEST WAFERS; WAFER BUMPING; X-RAY DIFFRACTION INVESTIGATIONS;

ALLOYS; BRAZING; ELECTRODEPOSITION; EUTECTICS; FLIP CHIP DEVICES; LEAD; POLYETHYLENE GLYCOLS; POLYETHYLENE OXIDES; SCANNING ELECTRON MICROSCOPY; SILVER ALLOYS; SOLDERING ALLOYS; SURFACE ACTIVE AGENTS; TIN ALLOYS; WELDING;

TIN;

EID: 69549135429 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.3194780 Document Type: Article

Times cited : (20)

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