Electrochemical processing technologies in chip fabrication: Challenges and opportunities

Electrochimica Acta

Volumn 48, Issue 20-22, 2003, Pages 2975-2985

  Datta, Madhav ^a  

^a INTEL CORPORATION   (United States)

Author keywords

Area array chip package interconnection; Chip fabrication; Cu metallization; Dual Damascene electroplating; Electrochemical processing technologies; Flip chip technology; Microprocessor

Indexed keywords

ELECTROCHEMISTRY; ELECTROMIGRATION; FLIP CHIP DEVICES; METALLIZING; MICROELECTRONICS;

CHIP FABRICATION;

MICROPROCESSOR CHIPS;

EID: 0041467481     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0013-4686(03)00363-3     Document Type: Conference Paper

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