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Volumn 88, Issue 1, 2011, Pages 46-52

Electrochemical-mechanical polishing application: Monitoring of electrochemical copper removal from current-voltage characteristics in HNO 3 electrolyte

(1) Seo, Yong Jin a

a Daebul University (South Korea)

Author keywords

Copper (Cu); Current voltage (I V); Cyclic voltammetry (CV); Electrochemical mechanical polishing (ECMP); HNO3 electrolyte; Linear sweep voltammetry (LSV)

Indexed keywords

ANODIC POTENTIALS; CHEMICAL-MECHANICAL POLISHING PROCESS; COPPER REMOVAL; CU SURFACES; CURRENT VOLTAGE; CURRENT VOLTAGE CURVE; ELECTROCHEMICAL CHARACTERISTICS; ELECTROCHEMICAL PROCESS; ELECTROCHEMICAL REACTIONS; HNO3 ELECTROLYTE; LINEAR SWEEP VOLTAMMETRY; MECHANICAL POLISHING;

BIOELECTRIC PHENOMENA; CHEMICAL MECHANICAL POLISHING; CHEMICAL POLISHING; COPPER; CYCLIC VOLTAMMETRY; ELECTROLYTES; POLISHING;

CURRENT VOLTAGE CHARACTERISTICS;

EID: 78049289403 PISSN: 01679317 EISSN: None Source Type: Journal
DOI: 10.1016/j.mee.2010.08.019 Document Type: Article

Times cited : (12)

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