Motor-Current-Based Real-Time End Point Detection of Shallow-Trench-Isolation Chemical Mechanical Polishing Process Using High-Selectivity Slurry

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 42, Issue 10, 2003, Pages 6396-6399

  Seo, Yong Jin ^a   Lee, Woo Sun ^b   Park, Jin Seong ^b   Kim, Sang Yong ^c  

^a Daebul University   (South Korea)

^b Chosun University   (South Korea)

^c Etch Team   (South Korea)

Author keywords

Chemical mechanical polishing (CMP); End point detection (EPD); High selectivity slurry (HSS); Motor current (MC); Shallow trench Isolation (STI)

Indexed keywords

ELECTRIC CURRENTS; ELECTRIC MOTORS; FABRICATION; REAL TIME SYSTEMS; SEMICONDUCTOR DEVICES; SILICA; SILICON NITRIDE; SILICON WAFERS; ULSI CIRCUITS;

END POINT DETECTION (EPD); HIGH-SELECTIVE SLURRY (HSS); MOTOR CURRENT (MC); SHALLOW TRENCH ISOLATION (STI);

CHEMICAL MECHANICAL POLISHING;

EID: 0348220490     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.42.6396     Document Type: Article

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